InvenSense, Inc. the leading provider of intelligent sensor system on chip (SoC) for Motion and Sound, will showcase the company’s latest Sensing Everything™ innovations for Mobile, Smart Home, Wearable, Industrial, and Automotive segments in booth #D61 in Hall 7 at the 2015 Mobile World Congress in Barcelona, Spain from March 2-5, 2015.
InvenSense will exhibit the company’s latest sensor System on Chip (SoC) technologies comprised of Motion, Imaging, Sound, and Location products. InvenSense will present hands-on demonstrations showcasing improved performance, increased accuracy and lower power consumption in applications such as Activity Tracking, Platform Stabilization, Health & Fitness, Navigation, TV control, and Optical Image Stabilization (OIS) in mobile solutions.
Please stop by our booth (Hall 7 #D61) to speak with InvenSense senior executive staff, product and technical members. For more details, or to schedule press and partner meeting to see any of the company’s product demonstrations at the show, contact [email protected]. For additional information and product images, please visit www.invensense.com or contact InvenSense Sales at [email protected]
InvenSense, Inc. (NYSE: INVN) is the world’s leading provider of intelligent sensor system on chip (SoC) for Motion and Sound in consumer electronic devices. The company’s patented InvenSense Fabrication Platform and MotionFusion® technology address the emerging needs of many mass-market consumer applications via improved performance, accuracy, and intuitive motion-, gesture- and sound-based interfaces. InvenSense technology can be found in Mobile, Wearables, Smart Home, Industrial, and Automotive products. InvenSense is headquartered in San Jose, California and has offices in Boston, China, Taiwan, Korea, Japan, France, Canada, Slovakia and Italy. More information can be found at www.invensense.com or follow us on Twitter at @InvenSense.