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Applied Nanotech Expands Research Agreement

Applied Nanotech Holdings, Inc. today announced that the third phase of its research project with a leading industrial chemical products company in Japan, announced on September 29, 2008, has been expanded and the previously announced funding of $700,000 has been increased to $1.2 million over the next twelve months in order to accelerate the prototyping of copper inkjettable inks and product introduction. The parties also expect a fourth phase of the project, of at least the same magnitude, to begin in October 2009 to expand the applications.

In addition, the companies agreed to enter negotiations to finalize an exclusive worldwide license to Applied Nanotech’s copper inks technology within the parameters set forth in the current research agreement between the companies. These parameters include an upfront payment of up to $2.0 million and a running royalty rate of 4% on sales of the copper ink product. The parties agreed to finalize and execute the license agreement no later than April 15, 2009. During the period until then, the parties will formulate a comprehensive worldwide license agreement drafted in both English and Japanese, based on the results of the R&D partnership.

“I believe that the almost immediate expansion of this program by $500,000 following on the heels of last week’s announcement, along with the significant agreement for the overall terms for a license, show the seriousness of this application in the minds of our customer. Printable inks may redefine the manufacturing process for a wide variety of electronic devices and ANI is at the forefront of these developments, with this partner, as well as two additional Phase I studies that we have underway,” said Tom Bijou, Chairman and CEO of Applied Nanotech Holdings, Inc.


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