When Amkor Technology was founded in 1968, many of the products that we take for
granted today existed only in the mind's eye of visionaries.
Amkor helped make these visions a reality by pioneering the outsourcing of
semiconductor assembly and test services. Today, Amkor is a strategic contract
manufacturing resource for many of the world's leading semiconductor companies.
We have developed unique expertise in high-volume manufacturing techniques and
have diversified and expanded our operational scope by establishing production
centers in strategic locations throughout Asia.
Amkor provides leading-edge package solutions such as Stacked Packaging, Flip
Chip, MicroLeadFrame®, System-in-Package, MEMS, Wafer Level Packaging (WLP),
CMOS Image Sensor Camera Modules, and Game, Memory and I/O Cards (AmkKard®) for
latest generation applications.
Amkor Grants GLOBALFOUNDRIES Non-Exclusive License to Copper Pillar Wafer Bump Technology
Ping Wang, Ph.D.
We speak with researchers behind the latest advancement in graphene hBN research that could boost the development of next-generation electronic and quantum devices.
Dr. Laurene Tetard
AZoNano speaks with Dr. Laurene Tetard from the University of Central Florida about her upcoming research into the development of nanotechnology that can detect animal-borne diseases. The hope is that such technology can be used to help rapidly control infected mosquito populations to protect public
Dr. Amir Sheikhi
AZoNano speaks with Dr. Amir Sheikhi from Pennsylvania State University about his research into creating a new group of nanomaterials designed to capture chemotherapy drugs before they impact healthy tissue, amending a fault traditionally associated with conventional nanoparticles.
The Filmetrics F40 turns your benchtop microscope into an instrument for measuring thickness and refractive index.
Nikalyte’s NL-UHV is a state-of-the-art tool that allows the generation and deposition of nanoparticles in an Ultra-High vacuum onto a sample to create a functionalized surface.
The Filmetrics® F54-XY-200 is a thickness measurement tool created for automated sequence measurement. It is available in various wavelength configuration options, allowing compatibility with a range of film thickness measurement applications.