When Amkor Technology was founded in 1968, many of the products that we take for
granted today existed only in the mind's eye of visionaries.
Amkor helped make these visions a reality by pioneering the outsourcing of
semiconductor assembly and test services. Today, Amkor is a strategic contract
manufacturing resource for many of the world's leading semiconductor companies.
We have developed unique expertise in high-volume manufacturing techniques and
have diversified and expanded our operational scope by establishing production
centers in strategic locations throughout Asia.
Amkor provides leading-edge package solutions such as Stacked Packaging, Flip
Chip, MicroLeadFrame®, System-in-Package, MEMS, Wafer Level Packaging (WLP),
CMOS Image Sensor Camera Modules, and Game, Memory and I/O Cards (AmkKard®) for
latest generation applications.
Amkor Grants GLOBALFOUNDRIES Non-Exclusive License to Copper Pillar Wafer Bump Technology
Siyu Chen, Ph.D.
In this interview, we discuss a new approach to surface-enhanced Raman spectroscopy that utilizes nano-pockets to capture target molecules, ensuring a highly sensitive way to detect chemical processes.
Dr. Yitong Dong
Dr. Yitong Dong has recently been awarded funding to study custom composite nanocrystals, which could help to create advanced quantum communication technologies. Learn more about this project in this interview.
Roey Elnathan, Ph.D.
We take a closer look at the fusion of nanotechnology and CAR-T therapy through our interview with Dr. Roey Elnathan about a new approach that harnesses the capabilities of nanoneedles to efficiently deliver genetic materials to target cells.
The Verifire™ interferometer system provides fast and reliable measurements of surface form error.
This article outlines how Unity, Oxford Instruments’ new detector for a revolutionary new imaging technique, can be used to revolutionize imaging.
Discover the compact, fast rotary table V-610 for precision testing and manufacture.