When Amkor Technology was founded in 1968, many of the products that we take for
granted today existed only in the mind's eye of visionaries.
Amkor helped make these visions a reality by pioneering the outsourcing of
semiconductor assembly and test services. Today, Amkor is a strategic contract
manufacturing resource for many of the world's leading semiconductor companies.
We have developed unique expertise in high-volume manufacturing techniques and
have diversified and expanded our operational scope by establishing production
centers in strategic locations throughout Asia.
Amkor provides leading-edge package solutions such as Stacked Packaging, Flip
Chip, MicroLeadFrame®, System-in-Package, MEMS, Wafer Level Packaging (WLP),
CMOS Image Sensor Camera Modules, and Game, Memory and I/O Cards (AmkKard®) for
latest generation applications.
Amkor Grants GLOBALFOUNDRIES Non-Exclusive License to Copper Pillar Wafer Bump Technology
Professor Andre Nel
In this interview, AZoNano speaks with Professor Andre Nel about his involvement in innovative research describing the development of a 'glass bubble' nanocarrier that could help drug formulations access pancreatic cancer cells.
Jingang Li, Ph.D.
In this interview, AZoNano speaks with Jingang Li from the University of California, Berkley, who offers an introduction to the Nobel Prize-winning technology, Optical Tweezers.
Steve Kosier, Ph.D.
In this interview, we speak with SkyWater Technology about the current state of the semiconductor industry, how nanotechnology has helped to shape this sector, and their new partnership which aims to increase the accessibility of semiconductor chips for start-ups and research groups across the Unite
NMR spectroscopy is a characterization technique that is extensively used by chemical researchers.
Inoveno’s PE-550 is a best-selling electrospinning/spraying machine that can be used for the continuous production of nanofibers.
The Filmetrics R54 advanced sheet resistance mapping tool for semiconductor and compound semiconductor wafers.