IBM Use Self Assembly to Create Airgaps in Microprocessors
IBM is applying a new form of Nanotech based self assembly in polymeric coatings to create the next generation of chip designs.
IBM has created development versions of its latest POWER6 microprocessor using self-assembly techniques to create a vacuum gap between the miles of on-chip wiring thereby aiding in the reduction of capacitance and thereby reducing energy consumption.
The company has moved self assembly out of the labs and into a commercial manufacturing environment.
It expects to begin manufacturing servers based on airgap-technology in 2009.
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