Applying AI-Driven Solutions to Semiconductor Digital Design Mariusz Grabowski In this interview, Mariusz Grabowski, a Design Engineer II at Cadence Design Systems, shares insights into his role, the cutting-edge field of semiconductor technology, and the dynamic intersection of digital design with AI-driven solutions.
Redux AFM: Expanding Access to Automated Nanoscale Imaging David Morris, ICSPI David Morris of ICSPI highlights the Redux AFM's ease of use, enhancing AFM accessibility for nanoscale imaging.
Project Pursues Ultra Low-Cost, Flexible Perovskite Solar Cells Prof. Hongxia Wang We speak with Professor Hongxia Wang from QUT about a new project that hopes to utilize graphene and other low-cost carbon materials to produce commercially viable, ultra low-cost, flexible perovskite solar cells.
Next-Generation Heating Technology with HDPlas® Functionalized-Graphene Underfloor Heating (FGUH)Haydale’s Functionalized-Graphene Underfloor Heating (FGUH) solutions powered by HDPlas® technology offer enhanced heat transfer properties while reducing energy consumption and simplifying installation processes. From Haydale Limited
Thermo Scientific Nicolet Apex FTIR SpectrometerEmploying the Thermo Scientific™ Nicolet™ Apex FTIR Spectrometer enables users to increase operational efficiency, maintain accuracy, and adhere to compliance standards. From Thermo Fisher Scientific – Materials & Structural Analysis
2030PV PRO™ Microspectrophotometer for Measuring UV-Visible-NIR Range Transmission, Reflectance and FluorescenceThis product profile describes the features and applications of the 2030PV PRO™ microspectrophotometer for measuring UV-visible-NIR range transmission. From CRAIC Technologies
Semiconductor Manufacturing & Adaptive Optics Benefit from Nanometer Scale Surface Shaping From PI (Physik Instrumente) LP 18 Mar 2024
Studying Electrical Properties -and More- with AFM From Bruker Nano Surfaces and Metrology 15 Mar 2024
How can you measure particle size CQAs in (sterile) pharmaceutical packaging? – Non-invasive measurements using SR-DLS From InProcess-LSP 15 Feb 2024