ILC Dover Introduces Innovative NanoPac Flexible System for Nanoparticle Containment

ILC Dover, the designer and manufacturer of NASA's space suits and a wide range of engineered film and fabric products, announced its innovative NanoPac™ flexible containment system, which exceeds new NIOSH (National Institute for Occupational Safety) standards for nanoparticle containment. As nanotechnology continues to expand into every industrial sector, workers may be at an increased risk of exposure to new nanomaterials such as nanotubes and nanofibers.

ILC Dover Engineered Controls Allow Safe Nanomanufacturing. (PRNewsFoto/ILC Dover)

For more than a decade, ILC Dover flexible containment systems have helped protect pharmaceutical and industrial workers processing hazardous ingredients by providing the engineering controls needed to eliminate contamination concerns to below 1 µg/m3. Using this same technology, they now support nanotechnology processing.

"Our systems offer the most cost effective containment solutions available while maintaining a clean manufacturing area with reduced particulate contamination, said Alan George , New Business Development Manager, Industrial Containment at ILC Dover. "We also offer customized systems, which support specific applications and adapt readily to any type of processing equipment. As the nanotechnology industry realizes its potential, ILC Dover will be there to provide the containment and control needed by this community."

Benefits Of NanoPac™ Include:

  • Reduced Capital costs over rigid isolators
  • Reduced product loss as with localized exhaust ventilation
  • Minimized downtime for cleaning
  • Maximizing product quality by eliminating cross contamination issues
  • Flexible operations for manufacturing
  • Ideal for short run and prototyping and scalable as transition to manufacturing
  • Maximized Operator safety and ergonomics
  • Protecting our Environment

ILC Dover NanoPac™ technology can be seen at the Nanotech 2013 Conference and Expo in Washington, DC May 13-14 (booth 116) and at the AiHce Conference in Montreal, Canada May 20-22 (booth 910).

Source: http://www.ilcdover.com/

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