Evactron® U50: Plasma De-Contaminator for UHV Chambers

The U50 Plasma De-Contaminator from Evactron is a small and simple plasma cleaner that features high performance for instruments and chambers designed to work at UHV conditions. The U50 provides high power cleaning to remove hydrocarbon contamination from chamber and sample surfaces.

The Evactron U50 De-Contaminator has been designed particularly for facilities that opt to make use of a wired touchpad interface to program cleaning parameters. An RS-232 cable links the touchpad (with dimensions of 134 × 112 × 69 mm) with the controller.

The streamlined PRS has a compact footprint and uses air plasma and UV afterglow to decrease hydrocarbon contamination, thus quickly providing the results.

The Evactron U50 Plasma Radical Source (PRS) has a compact design, which makes it a versatile solution for instrument chambers, sample prep chambers, or load locks. The Evactron U50 offers robust, rapid and effective cleaning throughout a comprehensive range of pressures, thereby enabling quick pumpdown time to UHV and hydrocarbon-free RGA spectra.

Evactron® U50: Plasma De-Contaminator for UHV Chambers

Image Credit: Evactron (XEI Scientific)

Evactron® U50: Plasma De-Contaminator for UHV Chambers

Image Credit: Evactron (XEI Scientific)

Image Credit: Evactron (XEI Scientific)

Use Evactron® cleaning with H2Ar or H2N for Reductive Chemistries.  If alternate gases are needed to clean ruthenium-coated sapphire mirrors or any surface sensitive to oxidation, Evactron dual action turbo plasma cleaning™ removes hydrocarbon deposits without incurring sputter damage or debris.  Oxygen containing gases have a significantly higher hydrocarbon removal rate but also come with some potentially unwanted side effects such as oxidation of silver and copper.

System Features

  • Dual-action cleaning available with plasma and UV afterglow
  • UHV compatibility guaranteed by Conflat 2.75 flange
  • RF Power of 75 W peak and provided up to 50 W continuous
  • Rapid cleaning—over 100 times quicker compared to early generation Evactron models
  • Energy-efficient radio frequency hollow cathode plasma (RFHC)
  • Power, recipes, number of cycles and cleaning time are programmable
  • Push-button cleaning operation available
  • Zero sputter etch prevents damage to sensitive components
  • Comes with tethered touchpad command communications module
  • Wide range of pressure operation: ranging from 0.3 Pa/2 mTorr to 80 Pa/600 mTorr
  • Can be baked to 150°C
  • Compliant with RoHS, CE, NRTL, TUV, and SEMI
  • TMP-compatible, avoiding the need for advance venting
  • Leak tested to <10−11 mBar (1.3E−9 Pa) or 10−11 Torr
  • Match or gas flow adjustments are not needed for plasma ignition

Evactron U50 System Specifications

  • Hardware interlock is available
  • Evactron U50 plasma radical source
  • RF Power—35 to 75 W at 13.56 MHz RFHC
  • Desktop controller with pushbutton operation
  • Compliant with CE, RoHS, NRTL, TUV and SEMI
  • 100 to 240 VAC 50/60 Hz input
  • Comes with tethered touchpad communication package
  • Chassis dimensions—W × H × D: 17.2″ × 3.5″ × 8.6″ (44 × 8.9 × 22 cm)

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