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STATS ChipPAC Announces New 300 mm Wafer Level Packaging Capability in Taiwan

STATS ChipPAC Ltd., a leading semiconductor test and advanced packaging service provider, today announced the expansion of its wafer level package (WLP) offering with new 300mm manufacturing capabilities in Taiwan.

18 Jan 2011

ARM, IBM to Develop Design Platforms Down to 14 nm Node for Advanced Consumer Electronics

ARM® [(LSE: ARM); (Nasdaq: ARMH)] and IBM (NYSE: IBM) today announced an agreement between the two companies to extend their collaboration on advanced semiconductor technologies to enable the rapid development of nex...

18 Jan 2011

Synopsys Delivers 28 nm Design Solution Based on Lynx Design System

Synopsys, Inc., a world leader in software and IP for semiconductor design, verification and manufacturing, today announced it is delivering a low power, high-performance system-on-chip (SoC) design solution optimized for the Common Platform alliance (CPA) 28-nanometer(nm) high-k metal gate (HKMG) technology.

From Synopsys, Inc. 18 Jan 2011

IBM, Toppan Printing to Develop Photomask Process for 14 nm Technology Node

Toppan Printing Co., Ltd. announced today that it has extended a joint development agreement with IBM for leading-edge photomask process, covering the 14 nanometer technology node for logic devices. The development w...

18 Jan 2011

Cadence Unveils New 32, 28-Nanometer Silicon Realization Reference Flow

Cadence Design Systems, Inc., a leader in global electronic design innovation, today introduced a qualified 32/28-nanometer reference flow targeting Common Platform™ technology.

From Cadence Design Systems 18 Jan 2011

NetLogic Microsystems Develops Next-Generation Silicon in Advanced 28 nm Process

NetLogic Microsystems, Inc., a worldwide leader in high-performance intelligent semiconductor solutions for next-generation Internet networks, today announced that it has developed and taped out its next-generation silicon in the advanced 28nm process at Taiwan Semiconductor Manufacturing Company (TSMC).

18 Jan 2011

OMRON to Launch New MEMS Flow Sensor for Use in Fuel Cell Systems

OMRON Corporation today announced plans to release the D6F-70, a 70L/min MEMS flow sensor optimized for measuring the gas flow rate of fuel cell systems.

18 Jan 2011

OptiXtal Unveils World's Smallest Supercapacitor

As technology fits into smaller and smaller footprints, the need for supercapacitors that can offer high functionality and long term reliability in extremely tight spaces has become critical. Now OptiXtal, a Delaware Corporation, introduces the world's smallest supercapacitor...the SuperXcap(tm) Mini.

18 Jan 2011

Researchers Develop Tiny Latex Spheres That Attract in Water to Form Unusual Structures

Researchers at the University of Illinois and Northwestern University have demonstrated bio-inspired structures that self-assemble from simple building blocks: spheres. The helical "supermolecules" are made ...

18 Jan 2011

California-Based Thin Film Solar Cell Manufacturer to Open New Facility in Oregon

SoloPower, Inc., a California-based manufacturer of flexible, thin film solar cells and modules, announces it will locate a high volume manufacturing facility in Wilsonville, Oregon.

18 Jan 2011

Analysis on Reverse Costing and Engineering Process of SiT8002 MEMS Oscillator

Research and Markets has announced the addition of the "SiTime SiT8002 MEMS oscillator Reverse Costing" report to their offering. Reverse costing & engineering process analysis of the famous MEMS Oscillator SiT80...

18 Jan 2011

Centice Announces New Platform for Computational Raman Spectroscopy

Centice Corporation, a pioneer in chemical verification and identification using Raman Spectroscopy and computational sensor technology, announced today the availability of an integration and solutions platform for the application of Computational Raman Spectroscopy to satisfy technology needs in process manufacturing, healthcare, public safety and materials science.

18 Jan 2011

CEA-Leti to Ramp Up Europe's First 300mm Lines Dedicated to 3D Integration Applications

CEA-Leti, a recognized leader in 3D integration R&D, will significantly expand its technology offering this month when it ramps up one of Europe's first 300mm lines dedicated to 3D-integration applications. B...

From CEA-Leti 17 Jan 2011

TOK to Join Program to Develop Maskless Lithography for IC Manufacturing

TOK and CEA-Leti today announced that TOK will join the new industry/research multi-partner program IMAGINE that is developing maskless lithography for IC manufacturing. The three-year project is led by CEA-Leti, a r...

17 Jan 2011

Nanometer Thick Conductive Layer on Transparent Insulating Material Shows Promise for Future Microelectronic Applications

Researchers at CNRS and Université Paris-Sud 11[1] have succeeded in creating a conductive layer on the surface of strontium titanate (SrTiO3), a transparent insulating material considered to be very promising for t...

17 Jan 2011