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Leading Korean DRAM Manufacturer Orders QXP 8300 ALD Product from AIXTRON

AIXTRON AG (FSE: AIX; NASDAQ: AIXG) today announced shipment of its next generation QXP 8300 ALD product to a leading Korean DRAM manufacturer. The tool will be fully operational at the customer site by the end of Q2 201...

From AIXTRON SE 15 Jun 2010

Comprehensive Analysis of Metal Oxide Nanopowders Market Globally

Research and Markets (http://www.researchandmarkets.com/research/ffb629/the_world_market_f) has announced the addition of the "The World Market for Metal Oxide Nanopowders" report to their offering. The Wor...

15 Jun 2010

TSMC Selects Pyxis’ NexusRoute-HPC Router for 28nm AMS Reference Flow

Design Automation Conference 2010 -- Pyxis Technology, Inc., the company innovating software solutions for the physical design and routing of custom integrated circuits (ICs), announced today that its NexusRoute-HPC (high performance custom) router has been selected for use in the TSMC 28nm Analog and Mixed-Signal (AMS) Reference Flow 1.0.

15 Jun 2010

Researchers Devise New Magnetic Recording Medium Made Up of Tiny Nanospheres

A new magnetic recording medium made up of tiny nanospheres has been devised by European researchers. The technology may lead to hard disks able to store more than a thousand billion bits of information in a square inch....

15 Jun 2010

X-FAB to Install 8-Inch MEMS Process Equipment to Increase Manufacturing Efficiency

X-FAB Silicon Foundries, a leading analog/mixed-signal foundry and expert in "More than Moore" technologies, announced it will expand its foundry service to include 8 in. (200 mm) MEMS wafer processing. Moving to the larger wafer diameter and monolithic MEMS/CMOS integration allows significant reductions in manufacturing costs.

15 Jun 2010

New DDR300 NIR Inspection System Enables Efficient Chip Production

McBain Systems has announced the first sale of its new DDR300 NIR (near infrared) Inspection System to one of the world’s largest semiconductor chip manufacturers. Installed in a fab in Kulim, Malaysia, the new Defe...

15 Jun 2010

TSMC Leverages Cadence’s Technologies to Design Complex Nanometer Chips

Cadence Design Systems, Inc. (NASDAQ: CDNS), the leader in global electronic design innovation, today announced that transaction-level modeling (TLM)-driven design and verification, 3D-IC implementation and integrated DFM are among the many cutting-edge Cadence® technologies and flows that have been incorporated into TSMC Reference Flow 11.0.

From Cadence Design Systems 15 Jun 2010

Researchers Explain Beading Mechanism of Saliva and Other Complex Fluids

Researchers at Rice University, Purdue University and the Massachusetts Institute of Technology have solved a long-standing mystery about why some fluids containing polymers -- including saliva -- form beads when th...

15 Jun 2010

SEMATECH Director to Speak on EDA Challenges at 2010 DAC

TECH today announced that Sitaram Arkalgud, director of 3D interconnect program at SEMATECH, will speak to leading technologists and electronics design suppliers attending the 47th Design Automation Conference (DAC) being held at the Anaheim Convention Center in Anaheim, CA, on June 13-18, 2010.

15 Jun 2010

Latest Advancements in Sensing Technologies Shown at Sensors Expo and Conference

Over 4,000 engineers, scientists and industry professionals from around the world gathered at the Donald E. Stephens Convention Center in Rosemont, IL last week for the Sensors Expo & Conference, the leading event in North America focused exclusively on sensors and sensor-integrated systems.

15 Jun 2010

New Vertically Optimized Nanometer Design Platform for Advanced Device Production

Samsung Electronics, Co., Ltd., GLOBALFOUNDRIES and Synopsys, Inc (NASDAQ: SNPS) today announced the delivery of the industry’s first complete vertically optimized 32/28 nanometer (nm) design platform. Demonstrating the strength of the collaboration established and announced at DAC a year ago, the companies are collectively providing a technology enablement solution for the design and manufacturing of advanced mobile and embedded devices.

From Synopsys, Inc. 15 Jun 2010

Scientists Discover New Properties of Graphene Oxide

Graphene oxide, a single-atomic-layered material made by reacting graphite powders with strong oxidizing agents, has attracted a lot of interest from scientists because of its ability to easily convert to graphene —...

15 Jun 2010

TSMC Includes EdXact’s Jivaro Software in 28nm AMS Reference Flow

EdXact, post-layout verification specialist today announced that its netlist reduction software Jivaro™ has been included in TSMC’s Analog/Mixed-Signal (AMS) Reference Flow for 28nm analog and mixed-signal circuit design.

15 Jun 2010

mPhase Receives U.S. Patent for Novel Silicon Membrane

mPhase Technologies, Inc. (OTCBB: XDSL) reported today that it has been granted a United States patent for the concept of a porous membrane made from silicon that is capable of controlling the flow of a wide range of liquids, including electrolytes, used in both primary and rechargeable batteries.

From MyPebble 15 Jun 2010

Cadence Supports TSMC's AMS Reference Flow 1.0 for 28-nm Process Technology

Cadence Design Systems, Inc. (NASDAQ: CDNS), the leader in global electronic design innovation, today announced its support for TSMC Analog/Mixed-Signal (AMS) Reference Flow 1.0 for advanced 28-nanometer process technology.

From Cadence Design Systems 15 Jun 2010