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Belgium's Leading Collective Research Center for High Technology Will Use the System for Projects with Member Companies Throughout Europe

Optomec announced today that Sirris, the leading high technology collective research center in Belgium, has purchased an Aerosol Jet deposition system. The system, which has been installed at Sirris' location in the Liege Science Park, will be used primarily for the development of printed RFID antennae, micro capacitors, micro systems, packaging, memory and other emerging printed electronics applications.

From Optomec 13 Apr 2010

Scientists Plug into Algae Cells and Harness Tiny Electric Current

In an electrifying first, Stanford scientists have plugged in to algae cells and harnessed a tiny electric current. They found it at the very source of energy production - photosynthesis, a plant's method of converti...

13 Apr 2010

Tiny Molecular Switch Turns Itself On or Off as it Detects Metallic Ions in its Immediate Surroundings

Two chemists at The Scripps Research Institute have synthesized a new nano-scale scientific tool - a tiny molecular switch that turns itself on or off as it detects metallic ions in its immediate surroundings. Featur...

13 Apr 2010

NIST Detector Counts Photons With 99 Percent Efficiency

Scientists at the National Institute of Standards and Technology (NIST) have developed* the world's most efficient single photon detector, which is able to count individual particles of light traveling through fiber optic cables with roughly 99 percent efficiency.

From National Institute of Standards and Tech (NIST) 13 Apr 2010

Nano-Tex Announces Three New Products

Nano-Tex, a leading fabric innovation company providing nanotechnology-based textile enhancements, announced today three new products - All Conditions, Speed Dry and Repels Water - to their current industry leading portfolio of repellency solutions.

From Nano-Tex 13 Apr 2010

Applied Materials Opens Advanced Semiconductor Equipment Plant in Singapore

Applied Materials, Inc., the world’s leading supplier of equipment to the semiconductor, flat panel display and solar photovoltaic (PV) industries, today opened its new Singapore Operations Center, Applied’s first facility in Asia for manufacturing its advanced semiconductor equipment.

From Applied Materials Inc. 13 Apr 2010

Vishay Announces Thin Film Chip Resistors in New Case Sizes

Vishay Intertechnology, Inc. today announced that it has extended its MC AT series of professional thin film chip resistors to include devices in the 0402, 0603, 0805, and 1206 case sizes.

13 Apr 2010

STATS ChipPAC Expands eWLB Technology to Reconstituted 300mm Wafers

STATS ChipPAC Ltd., a leading semiconductor test and advanced packaging service provider, today announced that it has expanded the embedded Wafer-Level Ball Grid Array (eWLB) technology to reconstituted 300mm wafers.

13 Apr 2010

New Mask Etcher MLS Allows for Etch of 250 to 180 nm Technology Nodes

Plasma-Therm, a global supplier of plasma process equipment, is pleased to announce the release of the latest product in the Mask Etcher series: Mask Etcher MLS.

13 Apr 2010

Ascent Solar Chosen by Cambrios as PV Research Partner

Ascent Solar Technologies, Inc. (NASDAQGM:ASTI), a developer of state of the art flexible thin-film solar modules, announced today that Cambrios Technologies Corporation, a firm that has developed innovative, wet-process...

13 Apr 2010

China Electronics Fair Features Touch Sensitive MP-4 Players Enabled by Carbon Nanotube TCF

Unidym, a majority owned subsidiary of Arrowhead Research Corporation (NASDAQ:ARWR), announced today that touch sensitive MP-4 players enabled by Unidym's transparent conductive films were displayed at the 75th China Electronics Fair.

13 Apr 2010

Hague Corp Changes Name to Better Reflect its Nanotechnology Business

Hague Corporation today announced it has changed its name to "Quantum Materials Corporation" to better reflect its nanotechnology business. The company also announced that effective Tuesday April 13, 2010 it ch...

13 Apr 2010

Non-Contact Measurement of Temperature Changes of Silicon Wafer During Heat Treatment

Yoshiro Yamada and Juntaro Ishii of the Radiation Thermometry Section, Temperature and Humidity Division, the Metrology Institute of Japan of the National Institute of Advanced Industrial Science and Technology (AIST), h...

13 Apr 2010

Rudolph Receives Multiple Orders for its Fab-Wide Process Analysis Software

Rudolph Technologies, Inc., a leading provider of process characterization equipment and software for wafer fabs and advanced packaging facilities, announced today the receipt of multiple orders for its Discover Enterprise™ fab-wide process analysis software.

From Onto Innovation 13 Apr 2010

Cadence Increases Tool Support in TSMC's 65nm Integrated Signoff Flow

Cadence Design Systems, Inc., the leader in global electronic design innovation, today announced that it increases tool support in TSMC's 65-nanometer Integrated Signoff Flow by introducing RTL Compiler, EDI System, QRC Extraction and Encounter Timing System for Signal Integrity into it.

From TSMC Taiwan Semiconductor Manufacturing Company 13 Apr 2010