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Heat Flow at Sub-Nanometer Distances Occurs Through “Phonon Tunneling”

Conduction and thermal radiation are two ways in which heat is transferred from one object to another: Conduction is the process by which heat flows between objects in physical contact, such as a pot of tea on a hot stove, while thermal radiation describes heat flow across large distances, such as heat emitted by the sun.

From Massachusetts Institute of Technology 9 Apr 2015

MEMS Sensor Developer, Standing Egg, Licenses Imagination's MIPS Warrior M-Class CPU

Imagination Technologies (IMG.L) announces that South Korea based MEMS sensor development company Standing Egg has licensed Imagination's MIPS Warrior M-class CPU for use in its next-generation sensor hubs targeting an expanding range of products including mobile devices, IoT, wearables, and automotive.

9 Apr 2015

Xilinx’s Virtex UltraScale 20nm FPGA Enables JDSU ONT 400G Ethernet Test Platform

Xilinx, Inc. today announced that its Virtex® UltraScale™ 20nm FPGA is enabling the JDSU ONT 400G Ethernet test platform. This new platform delivers 400G bandwidth and ensures precise analysis on a true packet-to-packet basis to support the needs and complexity of advanced 400G applications.

9 Apr 2015

Synopsys Offers Broad Portfolio of DesignWare PHY IP for TSMC's 16nm FinFET Plus Processes

Synopsys, Inc. today announced the availability of a broad portfolio of DesignWare® PHY IP for TSMC's 16-nanometer (nm) FinFET Plus (16FF+) processes, enabling designers to integrate required functionality in mobile and enterprise system-on-chips (SoCs) with less risk.

From Synopsys, Inc. 9 Apr 2015

Cavendish Kinetics Utilizes STATS ChipPAC's Wafer Level Technology for RF MEMS Tuning Solutions

STATS ChipPAC Ltd. ("STATS ChipPAC"), a leading provider of advanced semiconductor packaging and test services, today announced that Cavendish Kinetics, a leading provider of high performance RF MEMS tuning solutions for LTE smartphones and wearable devices, has adopted its advanced wafer level packaging technology to deliver Cavendish's SmarTune™ RF MEMS tuners in the smallest possible form factor, as a 2mm2 chip scale package.

9 Apr 2015

DFG Honors Karlsruhe Institute of Technology Chemist with 2015 Heinz Maier-Leibnitz Prize

The chemist Dr. Pavel Levkin of Karlsruhe Institute of Technology (KIT) is granted the 2015 Heinz Maier-Leibnitz Prize by the German Research Foundation (DFG). The prize is considered the highest distinction for young researchers in Germany. Scientific work of Pavel Levkin focuses on the investigation of cell-surface interactions, the development of biofunctional materials and super-water-repellent surfaces as well as on nanoparticles for specific medicine and gene transport. A major scientific success of Levkin was the synthesis of lipid-like molecules for gene modification of cells.

9 Apr 2015

Voltage Nanosensor Project Receives $1.35 Million HFSP Research Grant

An international team led by biophysicist Shimon Weiss, who holds UCLA’s Dean M. Willard Chair in Chemistry, has been awarded a prestigious Human Frontier Science Program (HFSP) research grant of $1.35 million over three years. The HFSP international program supports frontier research on the complex mechanisms of living organisms.

From University of California, Los Angeles 9 Apr 2015

Simple, Scalable Method to Purify Arrays of Single-Walled Carbon Nanotubes

The exceptional properties of tiny molecular cylinders known as carbon nanotubes have tantalized researchers for years because of the possibility they could serve as a successors to silicon in laying the logic for smaller, faster and cheaper electronic devices.

9 Apr 2015

Scannano and LFoundry Collaborate to Offer MEMS-Based Portfolio of Pressure Sensors

Scannano and LFoundry today announced a strategic long term relationship to apply Scannano’s disruptive NANO technologies to a wide spectrum of new product applications. The first of these new products will be a MEMS-based portfolio of pressure sensors.

9 Apr 2015

New Impact Assessment Report of Graphene in Key Sectors

Research and Markets has announced the addition of the "Impact Assessment of Graphene in Key Sectors" report to their offering.

From Research and Markets 9 Apr 2015

Promega Introduces New Nano-Glo Dual-Luciferase Reporter Assay

Promega Corporation announces the launch of the new Nano-Glo® Dual-Luciferase® Reporter (NanoDLR™) Assay, a two-reporter system that incorporates NanoLuc® luciferase technology, providing increased data quality and greater sensitivity for biologically complex applications.

9 Apr 2015

PLDA Partners with GUC to Create PCIe 4.0 Complete Solution on TSMC 16nm FinFET Plus Process

PLDA, the industry leader in PCI Express® controller IP solutions has partnered with GUC, the Flexible ASIC Leader™, to create the fully-integrated complete PCIe Gen 4 solution for TSMC’s 16nm FinFET Plus (16FF+) process. The new PCIe Gen 4 IP can be licensed immediately by system-on-a-chip (SoC) and system companies, enabling solutions that satisfy the throughput, latency and power demands of PCIe 4.0 applications.

9 Apr 2015

FibeRio and VF Corporation Announce Partnership to Develop Apparel Nanofiber Technology

FibeRio Technology Corporation, the total nanofiber solutions company, today announced a strategic partnership with VF Corporation.

8 Apr 2015

Multiphysics Software Provider, COMSOL, Announces Opening of New Office in Moscow

COMSOL, the leading provider of multiphysics simulation and analysis software, today announced the opening of a new office in Moscow, Russia. The new office provides sales and support for the growing community of COMSOL Multiphysics® users in Russia.

From COMSOL, Inc. 8 Apr 2015

OLED Encapsulation Company, PlasmaSi, Acquired by AIXTRON

AIXTRON SE, one of the world’s leading manufacturers of deposition systems for the semiconductor industry, today announced that it has acquired privately held Silicon Valley-based PlasmaSi, Inc. effective April 1, 2015. The purchase price may reach up to $16 million and will be paid in cash.

From AIXTRON SE 8 Apr 2015

Nanotechnology News

Heat Flow at Sub-Nanometer Distances Occurs Through “Phonon Tunneling”

MEMS Sensor Developer, Standing Egg, Licenses Imagination's MIPS Warrior M-Class CPU

Xilinx’s Virtex UltraScale 20nm FPGA Enables JDSU ONT 400G Ethernet Test Platform

Synopsys Offers Broad Portfolio of DesignWare PHY IP for TSMC's 16nm FinFET Plus Processes

Cavendish Kinetics Utilizes STATS ChipPAC's Wafer Level Technology for RF MEMS Tuning Solutions

DFG Honors Karlsruhe Institute of Technology Chemist with 2015 Heinz Maier-Leibnitz Prize

Voltage Nanosensor Project Receives $1.35 Million HFSP Research Grant

Simple, Scalable Method to Purify Arrays of Single-Walled Carbon Nanotubes

Scannano and LFoundry Collaborate to Offer MEMS-Based Portfolio of Pressure Sensors

New Impact Assessment Report of Graphene in Key Sectors

Promega Introduces New Nano-Glo Dual-Luciferase Reporter Assay

PLDA Partners with GUC to Create PCIe 4.0 Complete Solution on TSMC 16nm FinFET Plus Process

FibeRio and VF Corporation Announce Partnership to Develop Apparel Nanofiber Technology

Multiphysics Software Provider, COMSOL, Announces Opening of New Office in Moscow

OLED Encapsulation Company, PlasmaSi, Acquired by AIXTRON

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