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PIE Scientific Announces Revolutionary Intelligent Remote Plasma Cleaning Technology for Contamination Control in Scanning Electron Microscopes and other Vacuum Systems

PIE Scientific Announces Revolutionary Intelligent Remote Plasma Cleaning Technology for Contamination Control in Scanning Electron Microscopes and other Vacuum Systems

First Open-Source Algorithm Cooperative Announced at MEMS Executive Congress US 2014

First Open-Source Algorithm Cooperative Announced at MEMS Executive Congress US 2014

INVECAS to Operate SoC Design Service Centers to Provide Support for GLOBALFOUNDRIES Customers

INVECAS to Operate SoC Design Service Centers to Provide Support for GLOBALFOUNDRIES Customers

ANL Places $1.3 Million Order with CVD for UHV Deposition System

ANL Places $1.3 Million Order with CVD for UHV Deposition System

Novavax and Collaborators to Present RSV F Vaccine at 9th International Respiratory Syncytial Virus Symposium

Novavax and Collaborators to Present RSV F Vaccine at 9th International Respiratory Syncytial Virus Symposium

Tissue Decolorization Combined with Light-Sheet Fluorescent Microscopy Help Take Detailed Images of Individual Organs

Tissue Decolorization Combined with Light-Sheet Fluorescent Microscopy Help Take Detailed Images of Individual Organs

Researchers Observe Growth of Buckminsterfullerenes in Real Time

Researchers Observe Growth of Buckminsterfullerenes in Real Time

Technology Partnership with HWV Technologies In Water Treatment Solution for Oil & Gas Industry

Nanoparticles and Light Can Break Down BPA, Other Pollutants

Nanoparticles and Light Can Break Down BPA, Other Pollutants

Graphene Nanopores with Built-in Optical Antenna

Graphene Nanopores with Built-in Optical Antenna

ProPlus Design Solutions Releases Re-Innovated BSIMProPlus SPICE Modeling Platform for Nanometer Devices

ProPlus Design Solutions Releases Re-Innovated BSIMProPlus SPICE Modeling Platform for Nanometer Devices

Tango Systems Publishes Results for Conformal Step Seed Layer Coverage for TSVs with 15:1 Aspect Ratio

Tango Systems Publishes Results for Conformal Step Seed Layer Coverage for TSVs with 15:1 Aspect Ratio

STMicroelectronics Starts Production of MEMS Sensors using THELMA60 Surface-Micromachining Fabrication Process

STMicroelectronics Starts Production of MEMS Sensors using THELMA60 Surface-Micromachining Fabrication Process

Texas Instruments to Expand Manufacturing Capacity in Chengdu with 300mm Wafer Bumping Facility

Texas Instruments to Expand Manufacturing Capacity in Chengdu with 300mm Wafer Bumping Facility

ABAT and Long Power Systems Launch Superior Fast Charging Nano Lithium Titanate Battery

ABAT and Long Power Systems Launch Superior Fast Charging Nano Lithium Titanate Battery

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