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Challenges in Scaling Below 14nm to be Highlighted at Semicon West 2013

Semicon West 2013 will be held July 9-11 at the Moscone Center in San Francisco, and will feature over 500 exhibitors, 50 hours of conference programs and more than 30,000 industry attendees. In advance of the 2013 SEMICON West TechXPOTs on lithography and nonplanar transistors beyond 20nm, SEMI asked some of the speakers and industry experts to comment on the challenges they wanted to highlight. Many of the inputs focused on the need for precision in the processes used to form transistors, as well as how EDA can contribute to mitigating variability.

10 Jul 2013

Solutions to Integrate Logic and Memory to Flexible or Printed Electronics

Developers have made major progress in the technology to manufacture printed or flexible circuits, sensors, batteries and displays. But frankly it’s been hard to build applications with much market pull without logic or memory as well, and those have been much harder to make.

10 Jul 2013

CEA-Leti Programs Extend 193nm Immersion Lithography for 1X Nodes

CEA-Leti said today that its multi-partner programs, IDEAL and IMAGINE, have demonstrated cost-effective solutions that extend 193nm immersion lithography for 1X nodes for critical levels such as contact and via, and for the cut layer, when multi-patterning is used.

From CEA-Leti 10 Jul 2013

3D Nanostructured Chip Watermark Ink Receives 2013 R&D 100 Award

A device that can instantly identify unknown liquids based on their surface tension has been selected to receive the 2013 R&D 100 Award—known as “the Oscar of Innovation”—from R&D Magazine.

9 Jul 2013

Cadence Design Systems and TSMC Collaborate Extending SKILL-Based PDKs to 16 nm

In an effort to address the increasing complexity associated with advanced node designs, Cadence Design Systems, Inc., today announced that TSMC has expanded collaboration with Cadence on the Virtuoso custom and analog design platform to design and verify its own cutting-edge IP.

From Cadence Design Systems 9 Jul 2013

NanoViricides Signs Confidential Agreement with Public Health England for Testing of Different Nanoviricides

NanoViricides, Inc. (the "Company") said it has signed a “confidential disclosure agreement” with Public Health England, the British government’s equivalent of the U.S. Centers for Disease Control.

From NanoViricides, Inc 9 Jul 2013

Bioengineering Graduate Student to Design Nanofiber Scaffold as Synthetic Tendon Replacement

As sports injuries go, a torn tendon ranks right up there: searing pain, followed by a protracted period of healing that often lasts for months. If the rupture is severe there's surgery involved, and because of the heavy stresses tendons must endure, a simple reattachment doesn't always hold. Thus the market for tendon replacements.

9 Jul 2013

Researchers Discover Technique for Mass Production of Mesoporous Graphene Nanoballs for Supercapacitors

Researchers from Ulsan National Institute of Science and Technology (UNIST) developed a new method to massively synthesize enhanced yet affordable materials for supercapacitors.

9 Jul 2013

Researchers Use Nano-Structured Iron Oxide and Water to Produce Solar Hydrogen Bubbles

Water and some nano-structured iron oxide is all it takes to produce bubbles of solar hydrogen.

9 Jul 2013

ClassOne Equipment Deploys Fully Refurbished Spray Solvent Tool at US-Based MEMS Fab

ClassOne Equipment announced today that it has recently sold, installed, and released into production a fully refurbished SEMITOOL Spray Solvent Tool (SST) at a top tier, US based MEMs Fab for its resist strip process.

9 Jul 2013

Alchimer Collaborates with CEA-Leti to Implement Wet Nanometric Film Deposition Process

Alchimer, S.A. today announced a collaboration with the French research institute CEA-Leti to evaluate and implement Alchimer’s wet deposition processes for 300mm high-volume manufacturing.

9 Jul 2013

Applied SEMVision G6 Defect Analysis System Improves Yield for Chip Manufacture at 1X nm

Applied Materials, Inc. today announced a suite of new defect review and classification technologies for its market-leading SEMVision(TM) family of products to accelerate time to yield for leading-edge chip manufacturing at 1X-nm and beyond.

9 Jul 2013

FormFactor to Co-Sponsor Test Vision 2020 at Semicon West for Discussing IC Wafer Test Trends

At SEMICON West this week FormFactor Inc. will stage a strong presence through executive participation in key forums and sponsorship of select industry initiatives.

9 Jul 2013

FormFactor to Co-Sponsor Test Vision 2020 at Semicon West for Discussing IC Wafer Test Trends

At SEMICON West this week FormFactor Inc. will stage a strong presence through executive participation in key forums and sponsorship of select industry initiatives.

9 Jul 2013

EV Group Unveils Fusion Wafer Bonding Platform for Manufacturing 3D-Integrated CMOS Image Sensors

EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today introduced the latest version of its EVG®40NT automated measurement system, which is designed to work in concert with the company's GEMINI® FB fusion wafer bonding system to support the manufacture of next-generation 3D-integrated CMOS image sensors.

9 Jul 2013

Nanotechnology News

Challenges in Scaling Below 14nm to be Highlighted at Semicon West 2013

Solutions to Integrate Logic and Memory to Flexible or Printed Electronics

CEA-Leti Programs Extend 193nm Immersion Lithography for 1X Nodes

3D Nanostructured Chip Watermark Ink Receives 2013 R&D 100 Award

Cadence Design Systems and TSMC Collaborate Extending SKILL-Based PDKs to 16 nm

NanoViricides Signs Confidential Agreement with Public Health England for Testing of Different Nanoviricides

Bioengineering Graduate Student to Design Nanofiber Scaffold as Synthetic Tendon Replacement

Researchers Discover Technique for Mass Production of Mesoporous Graphene Nanoballs for Supercapacitors

Researchers Use Nano-Structured Iron Oxide and Water to Produce Solar Hydrogen Bubbles

ClassOne Equipment Deploys Fully Refurbished Spray Solvent Tool at US-Based MEMS Fab

Alchimer Collaborates with CEA-Leti to Implement Wet Nanometric Film Deposition Process

Applied SEMVision G6 Defect Analysis System Improves Yield for Chip Manufacture at 1X nm

FormFactor to Co-Sponsor Test Vision 2020 at Semicon West for Discussing IC Wafer Test Trends

FormFactor to Co-Sponsor Test Vision 2020 at Semicon West for Discussing IC Wafer Test Trends

EV Group Unveils Fusion Wafer Bonding Platform for Manufacturing 3D-Integrated CMOS Image Sensors

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