EXFO has introduced its MEMS optical switch test module called the IQS-9100B, the latest addition to the company’s Windows-based IQS-600 platform.
By Dr. Cameron Chai
8 Mar 2012
FlipChip International, a specialist in wafer level packaging (WLP) and flip chip bumping, has inked license, sales and marketing deals with NANIUM, a provider of production, engineering and testing services in the semiconductor industry, for 300 mm WLP and flip chip bumping.
By Dr. Cameron Chai
8 Mar 2012
STATS ChipPAC, a semiconductor solutions provider, has revealed the advanced 3D embedded Wafer Level Ball Grid Array Package-on-Package (PoP) technology solution.
By Dr. Cameron Chai
8 Mar 2012
Research and Markets has added a book titled "Understanding Microelectronics: A Top-Down Approach" to its offering. The author Franco Maloberti uses a top-down method to explain in detail the fundamentals of electronics.
Surrey NanoSystems has raised third round funding of £4.5 million (~US$7.1m) - one of the largest amounts secured by any UK semiconductor-focused company in the last year - from a consortium led by New Wave Venture...
The new Nano DS Dual Light Scattering Particle Size Analyzer from CILAS integrates a breakthrough technology that takes nanoparticle characterization to the next level. The Nano DS is the first nanoparticle size analyzer to combine Dynamic Light Scattering (DLS) and Static Light Scattering (SLS) in the same particle size instrument.
Key topics of nano-optics and plasmonics and their applications in research, lasers and solar energy were discussed at the 2012 Winter College on Optics conducted from February 6 to 17, 2012, at the Abdus Salam International Centre for Theoretical Physics (ICTP) in Trieste.
By Dr. Cameron Chai
7 Mar 2012
CALIENT Technologies, a specialist in photonic switching technology, has introduced its new 320-port photonic switch called the S320, the company’s next-generation 3D MEMS switching technology.
By Dr. Cameron Chai
7 Mar 2012
Cadence Design Systems has unveiled an advanced Cadence Encounter RTL-to-GDSII flow for giga-scale, high-performance designs that include those at the newest 20 nm technology node.
A research team comprising Tingrui Pan and his colleagues from the University of California, Davis has developed an ultrathin ‘nanoglue,’ which finds applications in the fabrication of new-generation microchips.
By Dr. Cameron Chai
7 Mar 2012
Following the great success of their Seminar hosted with the IOS-CAS in Beijing last year attended by over 100 participants, Oxford Instruments will hold a one day Seminar on 19th March in Shanghai, focussing on Nanoscal...
AMD has expanded its proven 28 nm GPU line with the introduction of new sleek graphics cards called the AMD Radeon HD 7850 and AMD Radeon HD 7870 GHz Edition.
By Dr. Cameron Chai
6 Mar 2012
A research team comprising Hiroshi Handa and his colleagues from the Tokyo Institute of Technology has determined an important protein called cereblon utilizing novel sub-micrometer functionalized magnetic nanobeads developed at the institute.
By Dr. Cameron Chai
6 Mar 2012
AMD has amended its wafer supply agreement (WSA) with GLOBALFOUNDRIES. In this deal, the two companies have settled with an agreeable wafer price mechanism for the fiscal year 2012.
Theoretical insights of a study conducted by a research team led by Junqiao Wu from the Lawrence Berkeley National Laboratory of the U.S. Department of Energy have explained in detail about the formation of nano-patterns called ‘alien’ crop circles during the annealing of a gold nanolayer over a flat silicon surface.
By Dr. Cameron Chai
3 Mar 2012