Insight Management has announced that Simpson Brothers Greenhouses is intending to use solar nanotechnology products of Insight Management for its daily greenhouse manufacturing operations located in Ovid, Michigan.
By Dr. Cameron Chai
22 Nov 2011
Oxford Instruments Nanoscience (OINS), World's leading supplier of cryogenic systems for nanocharacterisation and measurements at low temperatures and high magnetic fields, announces the launch of MercuryiTC cryogeni...
Research and Markets has declared that it now offers a comprehensive research book entitled ‘Emerging Nanotechnologies in Dentistry. Processes, Materials and Applications’ of Elsevier Science and Technology.
By Dr. Cameron Chai
21 Nov 2011
A team of researchers at the University of Tokyo, the University of Tsukuba, RIKEN and Fujitsu has declared that the research findings of the silicon nanowires’ electron states obtained utilizing ‘K computer’ has won the ACM Gordon Bell Prize under the Peak-Performance category at the International Conference for High Performance Computing, Networking, Storage and Analysis, SC11 conducted in Seattle, Washington.
By Dr. Cameron Chai
21 Nov 2011
A research team led by Seungpyo Hong, who serves as Assistant Professor of Biopharmaceutical Sciences at the University of Illinois at Chicago has developed a highly sensitive biomimetic surface utilizing the anti-epithelial cell adhesion molecule called aEpCAM and the dendrimers of seventh-generation polyamidoamine called PAMAM to remove circulating cancer cells from the blood.
By Dr. Cameron Chai
21 Nov 2011
Research and Markets now offers a new research report of Elsevier Science and Technology covering the materials, production and applications of ceramic thick film micro electromechanical systems (MEMS).
By Dr. Cameron Chai
21 Nov 2011
A nanoparticle-based GO2 additive of diesel fuel from Cerion Energy has been displayed by ECOsuperyacht in an exhibition at METS this year. ECOsuperyacht, a European distributor of the additive in the yachting market, received the most eco-friendly product award in the DAME Awards, 2011.
By Dr. Cameron Chai
19 Nov 2011
A research team led by Professor Chang-Beom Eom at the University of Wisconsin-Madison has found a way to create a low-voltage near-nanoscale electromechanical device by integrating a complex, single-crystal, piezoelectric material called lead magnesium niobate-lead titanate (PMN-PT) having ‘giant’ piezoelectric properties with silicon.
By Dr. Cameron Chai
19 Nov 2011
Scientists at the University of California-Irvine, the California Institute of Technology and HRL Laboratories have synthesized the world’s lightest metal having a density of 0.9 mg/cc, a value 100 folds lesser than the density of Styrofoam.
By Dr. Cameron Chai
19 Nov 2011
Toppan Printing’s subsidiary, Toppan Photomasks has declared plans to invest $20 million to expand the production capacity and technology capabilities of its Shanghai joint venture facility in order to meet the growing demand of the semiconductor industry in China.
A study conducted at the University of Southampton has emphasized the role of nanotechnology in the health field.
By Dr. Cameron Chai
19 Nov 2011
Research and Markets now offers a market research report on graphene industry titled ‘Global Graphene Market-Analyst View.’ According to the report, the key driving factor of the market is the demand from the semiconductor industry for a material having high-mobility electrons.
By Dr. Cameron Chai
19 Nov 2011
During the production of carbon nanotubes, tubes that are useful for solar cell applications get mixed with tubes that are useful for battery applications, resulting in a nanotube powder that cannot be used for any commercial purpose.
By Dr. Cameron Chai
19 Nov 2011
According to a study carried out by Dr. Eric R. Blough and his team at Marshall University’s Center for Diagnostic Nanosystems, cerium oxide nanoparticles, which are utilized as fuel additives to improve the fuel efficiency of engines of automobiles, can enter the liver from the lungs and cause damage to the liver.
By Dr. Cameron Chai
19 Nov 2011
STATS ChipPAC has declared the completion of the capacity expansion of its 300-mm wafer level chip scale packaging (WLCSP) and wafer bump facility located in Taiwan.
By Dr. Cameron Chai
18 Nov 2011