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DEK Presents Latest Advances in Print-on-Print Technology to ECN Delegates

DEK Solar Senior Process Development Specialist, Tom Falcon, recently presented the company's latest advances in print-on-print (PoP) technology to assembled delegates at a metallization workshop organised by the Ene...

11 Jun 2010

Gold Nanoparticles - Turning a Drawback into an Advantage

MIT researchers have found a way to turn this drawback into an advantage. In a paper recently published in American Chemical Society Nano, Associate Professor Kimberly Hamad-Schifferli of the Departments of Biological Engineering and Mechanical Engineering and postdoc Sunho Park PhD '09 of the Department of Mechanical Engineering reported that they could exploit nanoparticles' stickiness to double the amount of protein produced during in vitro translation - an important tool that biologists use to safely produce a large quantity of protein for study outside of a living cell.

11 Jun 2010

Observation of Shell Effects in Superconducting Nanoparticles of Tin

The loss of electrical resistance of a metal particle is also a matter of its size. A group of researchers has now proven that the temperature below which a material becomes a superconductor can increase dramatically, wh...

11 Jun 2010

Prototypes of New Black Fibre Material

Within the last years, the industry has developed resins with new properties by using nanotechnology. Such resins can be microwave active, meaning, that they can be cured by irradiations of microwaves. Using the new H...

11 Jun 2010

Samsung Austin to Expand its 12-Inch Semiconductor Fabrication Facility in Texas

Samsung Austin Semiconductor LLC today announced plans to expand the capacity of its 12-inch semiconductor fabrication plant in Austin with a $3.6 billion investment.

From Samsung Electronics 11 Jun 2010

MiaSole’s Thin-Film Solar Modules Achieve 13% Efficiency

MiaSole today announced that the U.S. Department of Energy's National Renewable Energy Laboratory (NREL) independently confirmed the 13.8% efficiency of its large area production modules (one square meter in size).

11 Jun 2010

Analysis on Global Thin Film Solar Cell Industry

Research and Markets (http://www.researchandmarkets.com/research/cb750b/2010_deep_research) has announced the addition of the "2010 Deep Research Report on Global and China Thin Film Solar Cell Industry" report to t...

11 Jun 2010

ADI Introduces Two New MEMS Inertial Sensors

Analog Devices, Inc. is helping industrial equipment manufacturers more easily implement stabilization, navigation, and control features by adding two highly integrated and precise MEMS inertial sensors to its product line of iSensor® motion sensor products.

From Analog Devices 11 Jun 2010

New Underarm Clothing Tag Eliminates Body Odour Using Nanotechnology

New iron-on tags made from controlled carbon material eliminate under arm smells; military-grade nano-porous fibre is breath of fresh air for clothing manufacturers and image-conscious consumers A new under...

11 Jun 2010

NanoString Releases Early Access Program for New nCounter Custom CNV Assays

NanoString Technologies, Inc., a privately held life sciences company marketing a complete solution for detecting and counting large sets of target molecules in biological samples, today announced the launch of its early access program for a unique new solution that detects copy number variation in human genomic samples.

From Nanostring Technologies 11 Jun 2010

Ensysce Secures Funds to Develop Single Walled Carbon Nanotube for siRNA Delivery

Ensysce Biosciences Inc. announced today they have received funding from the State of Texas Emerging Technology Fund. Funding of up to $1.5 million has been approved for the development of single walled carbon nanotube (SWCNT) therapeutics for the delivery of siRNA.

11 Jun 2010

Samsung Qualifies 32nm Low-Power HKMG Logic Process Technology

Samsung Electronics, Co., Ltd., a global leader in advanced semiconductor solutions, today announced that its foundry business, Samsung Foundry, has qualified 32nm low-power (LP) process with high-k metal gate (HKMG) technology.

From Samsung Electronics 11 Jun 2010

SiliconSmart ACE from Magma Supports UMC’s Move Towards 28-nm Technology

Magma® Design Automation (Nasdaq:LAVA), a provider of chip design software, today announced that UMC has standardized on SiliconSmart ACE for standard cell and I/O cell characterization and modeling. UMC co...

11 Jun 2010

Samsung Foundry Develops First 32-nm SoC Design with Synopsys' Galaxy Platform

Synopsys, Inc., a world leader in software and IP for semiconductor design, verification and manufacturing, today announced that Samsung Electronics' Foundry business (Samsung Foundry) has successfully taped out its first 32-nanometer (nm) system-on-chip (SoC) design using Synopsys' Galaxy™ Implementation Platform.

From Synopsys, Inc. 11 Jun 2010

SEMATECH Reports Progressions in Wafer-to-Wafer Bonding Alignment

Researchers from SEMATECH’s 3D Interconnect program based at the College of Nanoscale Science and Engineering’s (CNSE) Albany NanoTech Complex have reported advances in wafer-to-wafer bonding alignment accuracies through a series of tool and process hardening improvements.

11 Jun 2010