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New DDR300 NIR Inspection System Enables Efficient Chip Production

McBain Systems has announced the first sale of its new DDR300 NIR (near infrared) Inspection System to one of the world’s largest semiconductor chip manufacturers. Installed in a fab in Kulim, Malaysia, the new Defe...

15 Jun 2010

TSMC Leverages Cadence’s Technologies to Design Complex Nanometer Chips

Cadence Design Systems, Inc. (NASDAQ: CDNS), the leader in global electronic design innovation, today announced that transaction-level modeling (TLM)-driven design and verification, 3D-IC implementation and integrated DFM are among the many cutting-edge Cadence® technologies and flows that have been incorporated into TSMC Reference Flow 11.0.

From Cadence Design Systems 15 Jun 2010

Researchers Explain Beading Mechanism of Saliva and Other Complex Fluids

Researchers at Rice University, Purdue University and the Massachusetts Institute of Technology have solved a long-standing mystery about why some fluids containing polymers -- including saliva -- form beads when th...

15 Jun 2010

SEMATECH Director to Speak on EDA Challenges at 2010 DAC

TECH today announced that Sitaram Arkalgud, director of 3D interconnect program at SEMATECH, will speak to leading technologists and electronics design suppliers attending the 47th Design Automation Conference (DAC) being held at the Anaheim Convention Center in Anaheim, CA, on June 13-18, 2010.

15 Jun 2010

Latest Advancements in Sensing Technologies Shown at Sensors Expo and Conference

Over 4,000 engineers, scientists and industry professionals from around the world gathered at the Donald E. Stephens Convention Center in Rosemont, IL last week for the Sensors Expo & Conference, the leading event in North America focused exclusively on sensors and sensor-integrated systems.

15 Jun 2010

New Vertically Optimized Nanometer Design Platform for Advanced Device Production

Samsung Electronics, Co., Ltd., GLOBALFOUNDRIES and Synopsys, Inc (NASDAQ: SNPS) today announced the delivery of the industry’s first complete vertically optimized 32/28 nanometer (nm) design platform. Demonstrating the strength of the collaboration established and announced at DAC a year ago, the companies are collectively providing a technology enablement solution for the design and manufacturing of advanced mobile and embedded devices.

From Synopsys, Inc. 15 Jun 2010

Scientists Discover New Properties of Graphene Oxide

Graphene oxide, a single-atomic-layered material made by reacting graphite powders with strong oxidizing agents, has attracted a lot of interest from scientists because of its ability to easily convert to graphene —...

15 Jun 2010

TSMC Includes EdXact’s Jivaro Software in 28nm AMS Reference Flow

EdXact, post-layout verification specialist today announced that its netlist reduction software Jivaro™ has been included in TSMC’s Analog/Mixed-Signal (AMS) Reference Flow for 28nm analog and mixed-signal circuit design.

15 Jun 2010

mPhase Receives U.S. Patent for Novel Silicon Membrane

mPhase Technologies, Inc. (OTCBB: XDSL) reported today that it has been granted a United States patent for the concept of a porous membrane made from silicon that is capable of controlling the flow of a wide range of liquids, including electrolytes, used in both primary and rechargeable batteries.

From MyPebble 15 Jun 2010

Cadence Supports TSMC's AMS Reference Flow 1.0 for 28-nm Process Technology

Cadence Design Systems, Inc. (NASDAQ: CDNS), the leader in global electronic design innovation, today announced its support for TSMC Analog/Mixed-Signal (AMS) Reference Flow 1.0 for advanced 28-nanometer process technology.

From Cadence Design Systems 15 Jun 2010

Access Pharma to Conduct Cobalamin siRNA Program at CNSI Symposium

ACCESS PHARMACEUTICALS, INC. (OTC:ACCP) (BULLETIN BOARD: ACCP) , a biopharmaceutical company specializing in products for cancer and supportive care, announced that its Senior VP of R&D, David Nowotnik, Ph.D., w...

From Abeona Therapeutics Inc. 15 Jun 2010

TSMC Selects Lorentz’s Peakview EM Tool to Address Nanometer Design Procedures

Lorentz Solution, Inc. today announced that its flagship product, Peakview, had been included in RF Reference Design Kit 2.0 of TSMC. Part of the RF RDK 2.0 contained a critical voltage controlled oscillator (VCO) based on standard 65nm TSMC’s Process Design Kit (PDK) devices with proven design flow using industry standard parasitic extraction and physical verification tools.

15 Jun 2010

Altos and Extreme DA Develop Signal-Integrity Design Flow for 65-nm IC Designs

Altos Design Automation Inc. and Extreme DA™ have jointly developed an essential signal-integrity (SI) design flow for integrated circuit (IC) designs manufactured at process nodes of 65-nanometers (nm) and below. M...

15 Jun 2010

TSMC Selects Silicon’s 3D Extraction Software for AMS Reference Flow

Silicon Frontline Technology, Inc. (SFT), the silicon-proven, full-chip, field-solver company, announced today that its F3D (Fast 3D) parasitic extraction software for post-layout verification, has been selected as part of TSMC's 28 nanometer (nm) Analog and Mixed-Signal (AMS) Referenced Flow 1.0. F3D was chosen because it offers parasitic extraction with guaranteed accuracy along with the capacity and performance to handle large nm designs.

15 Jun 2010

MEMSIC Integrates IRIS Wireless Sensor with IBM Software

IBM (NYSE: IBM) today announced a contract with MEMSIC Inc. (Nasdaq: MEMS), a leading micro-electromechanical systems and sensor solution provider, to offer one of its most popular sensors with new IBM software that enables enterprises to build smarter products and systems. The announcement was made at the 2010 Sensors Expo & Conference.

15 Jun 2010