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Natcore Successfully Encapsulates Quantum Dots in Silicon Dioxide

Natcore Successfully Encapsulates Quantum Dots in Silicon Dioxide

Olympus-ITA to Exhibit 3D-IC Metrology Tool at SEMICON West 2010

Olympus-ITA to Exhibit 3D-IC Metrology Tool at SEMICON West 2010

New JVX7200 Metrology System Launched for Sub 45nm Technology

Genmark Introduces New Wafer Sorter

Genmark Introduces New Wafer Sorter

AlphaRx to Present GAI-122 Injectable Nanoemulsion at CRS Expo

Applied Materials to Showcase New Microchip Manufacturing Technologies

Applied Materials to Showcase New Microchip Manufacturing Technologies

Availability of Soitec’s Fully Depleted Planar Technology on UTBOX Wafers

Availability of Soitec’s Fully Depleted Planar Technology on UTBOX Wafers

Novartis Receives Licenses for Developing Nanobodies

Evonik Introduces New Barrier Film for Flexible Solar Modules

NEXX’s Stratus Tool Enables 300mm Lead-Free Wafer Bumping

NEXX’s Stratus Tool Enables 300mm Lead-Free Wafer Bumping

New 9900 System for Dicing Ultra-Thin Wafers from ESI

New 9900 System for Dicing Ultra-Thin Wafers from ESI

New Report on Global Innovation of Nano-Based Personal Care Products

Applied Materials to Service Equipment at NXP’s Wafer Facility in Holland

Applied Materials to Service Equipment at NXP’s Wafer Facility in Holland

New Initiative to Bring Clean Energy Technologies to Market

New Initiative to Bring Clean Energy Technologies to Market

GSA Launches Awareness Campaign to Support European Semiconductor Industry

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