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Imec Large-Area Epitaxial Solar Cell with Efficiency of 16.3% on High-Quality Substrate

Imec realized large-area (70cm2) epitaxial solar cells with efficiencies of up to 16.3% on high-quality substrates. And efficiencies of up to 14.7% were achieved on large-area low-quality substrates, showing the potential of thin-film epitaxial solar cells for industrial manufacturing.

From IMEC 13 Jul 2010

Imec Reports Promising Results in Extreme Ultraviolet Lithography Mask Cleaning Program

Imec today reports promising results in its Extreme Ultraviolet Lithography (EUV) mask cleaning program for defect-free EUV masks which are crucial in achieving high chip manufacturing yield.

From IMEC 13 Jul 2010

Micron Technology, Applied Materials, and Ultratech Joins imec IIAP on GaN-on-Si Technology

Micron Technology, Applied Materials, and Ultratech have joined the imec industrial affiliation program (IIAP) on GaN-on-Si technology. This multi-partner R+D program focuses on the development of GaN-on-Si (gallium nitr...

From IMEC 13 Jul 2010

How Soccer Ball Molecules Push Their Way Under Surfaces

HZB researchers observe atomic processes while doping semicon-ductor materials Fullerene and graphene, two forms of carbon only recently discovered, have been stimulating the imaginations of researchers ever since their ...

13 Jul 2010

Applied Materials’ Endura System Marks 20 Years of Achievement

Applied Materials, Inc. today celebrates the 20th year of its Applied Endura® platform, the most successful metallization system in the history of the semiconductor industry.

From Applied Materials Inc. 13 Jul 2010

UAT Expands Wafer Bumping Facility in Malaysia

Unisem Advanced Technologies (UAT) announced today that it is expanding wafer bumping capacity in its factory in Ipoh, Malaysia.

13 Jul 2010

Bayer MaterialScience Joins Holst Centre Flexible Electronics Research

Bayer MaterialScience AG, one of the world's largest producers of polymers and high-performance plastics, and Holst Centre, an open-innovation initiative by research organizations IMEC (Belgium) and TNO (The Netherla...

13 Jul 2010

AIXTRON Receives Order from Major Taiwanese Foundry

AIXTRON AG today announced an order for its QXP-8300 ALD deposition tool from a major Taiwanese foundry. The order is for a 300MM system for the deposition of next generation high-k materials by Atomic Layer Deposition (ALD). The order was received in the first quarter of 2010 and the system will be delivered in the second half of this year.

From AIXTRON SE 13 Jul 2010

Rudolph’s NSX System Chosen for MEMS Processing by Fraunhofer ISIT

Rudolph Technologies, Inc., a leading provider of process characterization equipment and software for wafer fabs and advanced packaging facilities, announced that the Fraunhofer Institute for Silicon Technology (ISIT) in Germany has placed an order for an NSX® Series Macro Inspection System for advanced MEMS processing.

From Onto Innovation 13 Jul 2010

FRT Expects Future Investment on Wafer Production Equipment

With a 142% rise in turnover, the semiconductor sector is thriving, fueled by FRT's innovative automated metrology solutions for production efficiency.

From SEMI 13 Jul 2010

New AdvantEdge Mesa System Delivers Sub-Nanometer CD Uniformity

Applied Materials, Inc. today unveiled its new Applied Centura® AdvantEdge™ Mesa™ system for creating nano-scale circuit features with angstrom-level precision in next-generation DRAM, Flash and Logic devices.

From Applied Materials Inc. 13 Jul 2010

Nansulate Coating Provides Effective Insulation for All Boat Types

Industrial Nanotech, Inc., an emerging global leader in nanotechnology based energy saving solutions, reported today that the Company's Nansulate® thermal insulation and mold resistant coatings provide effective insulation and protection for boats and sailboats and effectively reduce interior cabin temperature.

From Industrial Nanotech, Inc. 13 Jul 2010