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Novel Nano Particle Catalysts Facilitate Opposite Reactions

Chemists at the Ruhr-Universität Bochum have made a decisive step towards more cost-efficient regenerative fuel cells and rechargeable metal-air batteries. They developed a new type of catalyst on the basis of carbon, which can facilitate two opposite reactions: electrolysis of water and combustion of hydrogen with oxygen.

10 Jul 2014

Geckos and Spiders Can’t Sit Upside Down Forever

Not even geckos and spiders can sit upside down forever. Nanophysics makes sure of that. Mechanics researchers at Linköping University have demonstrated this in an article just published in Physical Review E. Knowledge that can be of great industrial benefit.

10 Jul 2014

DNA Nanopyramids Can Flag and Kill Bacteria

Bacterial infections usually announce themselves with pain and fever but often can be defeated with antibiotics — and then there are those that are sneaky and hard to beat. Now, scientists have built a new weapon against such pathogens in the form of tiny DNA pyramids.

From American Chemical Society 10 Jul 2014

CNSE/ SUNYIT and Nikon to Showcase Fully Patterned 450mm Wafers at SEMICON West

Demonstrating significant progress in the industry transition to 450mm wafer technology, and in support of New York Governor Andrew M. Cuomo’s commitment to New York’s leadership in the development of next generation technologies, the newly merged SUNY College of Nanoscale Science and Engineering (CNSE)/SUNY Institute of Technology (SUNYIT), along with Global 450mm Consortium (G450C) partner Nikon Corporation, today announced the world’s first fully patterned 450mm wafers will be revealed at SEMICON West.

From College of Nanoscale Science and Engineering, University at Albany 10 Jul 2014

Synopsys DesignWare AEON Trim NVM IP Available for High-Voltage Processes

Synopsys, Inc., a global leader providing software, IP and services used to accelerate innovation in chips and electronic systems, today announced the availability of the DesignWare AEON Trim NVM IP for high-voltage processes. The new IP is up to 75 percent smaller than alternative NVM IP solutions, helping to reduce the size and cost of automotive ICs.

From Synopsys, Inc. 10 Jul 2014

Vacuum-Compatible Versions of the LPS-24 Announced by Physik Instrumente

Thus, they fulfil important requirements for the positioning of optical and mechanical components or for the adjustment and manipulation of samples in vacuum with a confined space.

From Physik Instrumente (PI) GmbH & Co KG 9 Jul 2014

memsstar Introduces New Etch and Deposition Process Tools for MEMS Manufacturing

memsstar Limited, a leading provider of etch and deposition equipment and technology solutions to manufacturers of semiconductors and micro-electrical mechanical systems (MEMS), today launched its ORBIS™ platform of etch and deposition process tools for MEMS manufacturing. ORBIS systems deliver the industry's most advanced single-wafer process capability, required to meet the uniformity and repeatability requirements for advanced MEMS manufacturing.

From memsstar Ltd. 9 Jul 2014

New Excimer Laser Debonder from SUSS MicroTec

SÜSS MicroTec, a leading supplier of equipment and process solutions for the semiconductor and related markets, has launched an excimer laser debonder, the ELD300, for the stress free debonding of 200 and 300mm 3D-IC wafers, today.

From SUSS MicroTec AG 9 Jul 2014

Singlet Fission Has the Potential to Boost Solar Cell Efficiency

A perspective article published last month by University of California, Riverside chemists in the Journal of Physical Chemistry Letters was selected as an Editors Choice—an honor only a handful of research papers receive. The perspective reviews the chemists' work on "singlet fission," a process in which a single photon generates a pair of excited states. This 1->2 conversion process, as it is known, has the potential to boost solar cell efficiency by as much as 30 percent.

9 Jul 2014

Nano-Silicon Synthesised from Beach Sand Holds Promise for Li-ion Batteries with Longer Life

Researchers at the University of California, Riverside's Bourns College of Engineering have created a lithium ion battery that outperforms the current industry standard by three times. The key material: sand. Yes, sand.

From University of California at Riverside 9 Jul 2014

Cascade Microtech Launches Waveguide Probes for On-Wafer Probing of Sub-Millimeter Wave Circuits

Cascade Microtech, Inc., a leading supplier of solutions that enable precision measurements of integrated circuits at the wafer level, today announced the launch of the T-Wave series of waveguide probes for on-wafer probing of millimeter wave and sub-millimeter wave circuits.

From FormFactor 9 Jul 2014

Nanolab Technologies Acquires New X-ray Photoelectron Spectroscopy System

At SEMICON West in San Francisco, Nanolab Technologies announced that it has purchased a new XPS analytical system in their Surface Chemical Analysis Center of Excellence that continues their rapid growth path. Last week Nanolab Technologies announced the acquisition of Microtech Laboratories, a failure analysis lab located in Texas.

9 Jul 2014

FinScale Offers qFinFET 3D MOSFET Architecture and Manufacturable Process

FinScale Incorporated,the semiconductor device and process innovation company, today announced immediate availability of its qFinFET™ technology, a next generation 3D MOSFET architecture and manufacturable process readily transferable to foundries and integrated device manufacturers.

9 Jul 2014

Phantoms Foundation Releases Catalogue of Companies Working on Graphene at International Conference & Exhibition Graphene 2014

Phantoms Foundation is pleased to announce a catalogue of companies working on Graphene launched during the International Conference & Exhibition Graphene 2014 (Toulouse, France) back in May. The first edition features only companies working directly on the field. The second version (2015) to be launched during Graphene 2015 (10-13 March, 2015) will include all those who work hard in Universities, Research Centers, etc.

9 Jul 2014

Hitachi employs Cadence Tempus Timing Signoff Solution to Tape Out 28nm Design

Cadence Design Systems, Inc., a leader in global electronic design innovation, today announced that Hitachi has taped out its latest giga-scale design using the Cadence Tempus™ Timing Signoff Solution. Hitachi also utilized Tempus Timing Signoff Optimization (TSO), resulting in a reduction of their overall closure time to just 3 weeks down from almost 2 months.

From Cadence Design Systems 8 Jul 2014