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Vacuum-Compatible Versions of the LPS-24 Announced by Physik Instrumente

Thus, they fulfil important requirements for the positioning of optical and mechanical components or for the adjustment and manipulation of samples in vacuum with a confined space.

From Physik Instrumente (PI) GmbH & Co KG 9 Jul 2014

memsstar Introduces New Etch and Deposition Process Tools for MEMS Manufacturing

memsstar Limited, a leading provider of etch and deposition equipment and technology solutions to manufacturers of semiconductors and micro-electrical mechanical systems (MEMS), today launched its ORBIS™ platform of etch and deposition process tools for MEMS manufacturing. ORBIS systems deliver the industry's most advanced single-wafer process capability, required to meet the uniformity and repeatability requirements for advanced MEMS manufacturing.

From memsstar Ltd. 9 Jul 2014

New Excimer Laser Debonder from SUSS MicroTec

SÜSS MicroTec, a leading supplier of equipment and process solutions for the semiconductor and related markets, has launched an excimer laser debonder, the ELD300, for the stress free debonding of 200 and 300mm 3D-IC wafers, today.

From SUSS MicroTec AG 9 Jul 2014

Singlet Fission Has the Potential to Boost Solar Cell Efficiency

A perspective article published last month by University of California, Riverside chemists in the Journal of Physical Chemistry Letters was selected as an Editors Choice—an honor only a handful of research papers receive. The perspective reviews the chemists' work on "singlet fission," a process in which a single photon generates a pair of excited states. This 1->2 conversion process, as it is known, has the potential to boost solar cell efficiency by as much as 30 percent.

9 Jul 2014

Nano-Silicon Synthesised from Beach Sand Holds Promise for Li-ion Batteries with Longer Life

Researchers at the University of California, Riverside's Bourns College of Engineering have created a lithium ion battery that outperforms the current industry standard by three times. The key material: sand. Yes, sand.

From University of California at Riverside 9 Jul 2014

Cascade Microtech Launches Waveguide Probes for On-Wafer Probing of Sub-Millimeter Wave Circuits

Cascade Microtech, Inc., a leading supplier of solutions that enable precision measurements of integrated circuits at the wafer level, today announced the launch of the T-Wave series of waveguide probes for on-wafer probing of millimeter wave and sub-millimeter wave circuits.

From FormFactor 9 Jul 2014

Nanolab Technologies Acquires New X-ray Photoelectron Spectroscopy System

At SEMICON West in San Francisco, Nanolab Technologies announced that it has purchased a new XPS analytical system in their Surface Chemical Analysis Center of Excellence that continues their rapid growth path. Last week Nanolab Technologies announced the acquisition of Microtech Laboratories, a failure analysis lab located in Texas.

9 Jul 2014

FinScale Offers qFinFET 3D MOSFET Architecture and Manufacturable Process

FinScale Incorporated,the semiconductor device and process innovation company, today announced immediate availability of its qFinFET™ technology, a next generation 3D MOSFET architecture and manufacturable process readily transferable to foundries and integrated device manufacturers.

9 Jul 2014

Phantoms Foundation Releases Catalogue of Companies Working on Graphene at International Conference & Exhibition Graphene 2014

Phantoms Foundation is pleased to announce a catalogue of companies working on Graphene launched during the International Conference & Exhibition Graphene 2014 (Toulouse, France) back in May. The first edition features only companies working directly on the field. The second version (2015) to be launched during Graphene 2015 (10-13 March, 2015) will include all those who work hard in Universities, Research Centers, etc.

9 Jul 2014

Hitachi employs Cadence Tempus Timing Signoff Solution to Tape Out 28nm Design

Cadence Design Systems, Inc., a leader in global electronic design innovation, today announced that Hitachi has taped out its latest giga-scale design using the Cadence Tempus™ Timing Signoff Solution. Hitachi also utilized Tempus Timing Signoff Optimization (TSO), resulting in a reduction of their overall closure time to just 3 weeks down from almost 2 months.

From Cadence Design Systems 8 Jul 2014

Platin-M Entrapped in a Nanoparticle Interferes with Mitochondria's DNA and Triggers Cell Death

University of Georgia researchers have developed a new formulation of cisplatin, a common chemotherapy drug, that significantly increases the drug's ability to target and destroy cancerous cells.

8 Jul 2014

Intel to Produce Panasonic SoCs Using 14nm Low-Power Manufacturing Process

Intel Corporation today announced that it has entered into a manufacturing agreement with Panasonic Corporation’s System LSI Business Division. Intel’s custom foundry business will manufacture future Panasonic system-on-chips (SoCs) using Intel’s 14nm low-power manufacturing process.

8 Jul 2014

AMEC Introduces Integrated Dual-Station Etch and Plasma Downstream Asher Semiconductor Processing Tool

Advanced Micro-Fabrication Equipment Inc. (AMEC) today introduced the Primo Integrated Dual-Station Etch and plasma downstream Asher ( Primo iDEA™), an industry-first semiconductor processing tool that integrates dual-station dielectric etch and photoresist strip chambers onto the same platform.

8 Jul 2014

Forecast Report on Transparent Conductive Film Market

According to a new report by Allied Market Research, titled "Transparent Conductive Film (TCF) Market (Technologies, Applications and Geography) - Global Opportunity Analysis and Forecast - 2013 - 2020", the global transparent conductive film (TCF) market is forecast to reach $5.86 billion by 2020, growing at a CAGR of 17.2% during the forecast period (2014 - 2020).

8 Jul 2014

New Applied Materials’ CMP System Provides Wafer Polishing with Nano Precision for FinFET and 3D NAND Applications

Demonstrating its expertise in precision materials engineering, Applied Materials, Inc. today announced two new systems that help customers solve critical challenges in manufacturing high-performance, power-efficient 3D devices.

From Applied Materials Inc. 8 Jul 2014

Nanotechnology News

Vacuum-Compatible Versions of the LPS-24 Announced by Physik Instrumente

memsstar Introduces New Etch and Deposition Process Tools for MEMS Manufacturing

New Excimer Laser Debonder from SUSS MicroTec

Singlet Fission Has the Potential to Boost Solar Cell Efficiency

Nano-Silicon Synthesised from Beach Sand Holds Promise for Li-ion Batteries with Longer Life

Cascade Microtech Launches Waveguide Probes for On-Wafer Probing of Sub-Millimeter Wave Circuits

Nanolab Technologies Acquires New X-ray Photoelectron Spectroscopy System

FinScale Offers qFinFET 3D MOSFET Architecture and Manufacturable Process

Phantoms Foundation Releases Catalogue of Companies Working on Graphene at International Conference & Exhibition Graphene 2014

Hitachi employs Cadence Tempus Timing Signoff Solution to Tape Out 28nm Design

Platin-M Entrapped in a Nanoparticle Interferes with Mitochondria's DNA and Triggers Cell Death

Intel to Produce Panasonic SoCs Using 14nm Low-Power Manufacturing Process

AMEC Introduces Integrated Dual-Station Etch and Plasma Downstream Asher Semiconductor Processing Tool

Forecast Report on Transparent Conductive Film Market

New Applied Materials’ CMP System Provides Wafer Polishing with Nano Precision for FinFET and 3D NAND Applications

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