CVD Equipment, a company that designs and manufactures graphene, semiconductors, carbon nanotubes, MEMS, nanowires, and industrial coatings, received orders of nearly $24.6M for the first six months of 2011.
By Dr. Cameron Chai
14 Jul 2011
Berkeley Design Automation has signed new contracts with EDA distributors in order to improve demand for the Analog FastSPICE Platform.
By Dr. Cameron Chai
14 Jul 2011
Gigaphoton declared that the company is planning to ship its innovative technology for debris mitigation using magnetic fields in 2012 for laser-produced plasma (LPP) type light sources.
By Dr. Cameron Chai
14 Jul 2011
Rice University chemists have developed a platform to study the interactions between various photoluminescent materials and carbon nanotubes.
By Dr. Cameron Chai
14 Jul 2011
Gennum Snowbush IP group has introduced the next-generation multi-standard (MS) PHY IP Platform on TSMC 28nm to help semiconductor manufacturers to significantly lower design and production costs and to improve product time-to-market.
By Dr. Cameron Chai
14 Jul 2011
Today SUSS MicroTec, a global supplier of equipment and process solutions for the semiconductor industry and related markets, launched its new MaskTrack Pro InSync - the first holistic in-fab EUVL mask management offerin...
Cientifica, the worlds most respected nanotechnology information and forecasting company has just released the much anticipated 2011 report on global nanotechnology funding and impact.
Report Linker has added a new report, Thin Film Solar PV Manufacturing Equipment Worldwide, to its offerings.
By Dr. Cameron Chai
13 Jul 2011
Synopsys, a company that supplies intellectual property and software for semiconductor design, production, and validation, declared that it has joined hands with GLOBALFOUNDRIES to design, support, test, and distribute i...
By Dr. Cameron Chai
13 Jul 2011
Mattson Technology has released the paradigmE Si into the market, which is useful for semi-crucial silicon etch applications.
By Dr. Cameron Chai
13 Jul 2011
Avantor Performance Materials have signed a joint development agreement (JDA) with SACHEM to deliver customized, next-generation selective etch chemical solutions to be suitable for semiconductor manufacturing.
By Dr. Cameron Chai
13 Jul 2011
Advanced Micro-Fabrication Equipment is unveiling its second-generation 300 mm ultra-high frequency advanced decoupled reactive ion etch (AD-RIE) system called the Primo AD-RIE tool, which is ideal for major process challenges at 22 nm and below at SEMICON West.
By Dr. Cameron Chai
13 Jul 2011
SiTime, a company that manufactures analog semiconductors, has launched high-stable, MEMS voltage controlled, temperature compensated oscillator (VCTCXO) devices.
By Dr. Cameron Chai
13 Jul 2011
Synopsys, a company that provides IP and software to design and manufacture semiconductors, declared that its design enablement partnership with Samsung Electronics has resulted in the successful release of the 20 nm test chip implemented using the High-k metal gate (HKMG) process technology from Samsung.
By Dr. Cameron Chai
13 Jul 2011
Entegris and CEA-Leti have signed a two-year contract to observe cross-molecular contamination that occurs between semiconductor containers and wafers.