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Fairchild Semiconductor Adds Eight-Inch Wafer Fabrication Line in Korea

Fairchild Semiconductor, a leading global supplier of high performance power and mobile semiconductor solutions, officially opens an eight-inch wafer fabrication line in Bucheon, Korea. This new Fab symbolizes the company's focus on innovative power semiconductor solutions, as well as its investment in improving quality and responding to evolving market dynamics.

11 Jul 2013

Ultrafast Laser Nanostructuring in Glass Enables 5D Data Storage

Using nanostructured glass, scientists at the University of Southampton have, for the first time, experimentally demonstrated the recording and retrieval processes of five dimensional digital data by femtosecond laser writing.

11 Jul 2013

Xilinx Tapes Semiconductor Industry's First 20nm Device

Xilinx, Inc. announced two more industry firsts at 20nm, expanding on a series of industry innovations started at 28nm. Xilinx has now taped out the semiconductor industry's first 20nm device, and the PLD industry's first 20nm All Programmable device.

11 Jul 2013

New Nanomaterial Holds Potential for Carbon Dioxide Emission Reduction

University of Adelaide researchers have developed a new nanomaterial that could help reduce carbon dioxide emissions from coal-fired power stations.

10 Jul 2013

Digi-Key Becomes Distributor for InvenSense's MEMS MotionTracking Solutions

InvenSense, Inc., the leading provider of MotionTracking™ devices and global electronics components distributor Digi-Key Corporation, the worldwide leader in electronic component selection, availability and delivery, announced a global distribution agreement.

10 Jul 2013

New Report Covers Quantum Dot Materials, Technologies, and Products

Industry Analyst firm NanoMarkets today announced the addition of a new report to its publication schedule titled, "Market Opportunities for Quantum Dots" that will be released the week of July 29, 2013.

10 Jul 2013

Researchers Pave Way for Integration of Graphene into Current Silicide-Based Technology

The remarkable material graphene promises a wide range of applications in future electronics that could complement or replace traditional silicon technology. Researchers of the Electronic Properties of Materials Group at the University of Vienna have now paved the way for the integration of graphene into the current silicide based technology. They have published their results in the new open access journal of the Nature Publishing group, Scientific Reports.

10 Jul 2013

NanoMech Wins R&D 100 Award for its Innovative Product, TuffTek

The editors of R&D Magazine announced NanoMech’s TuffTek® as a winner of the coveted R&D 100 Award. This award places TuffTek® in an elite class of innovative products and recognizes it as one of the most technologically significant products introduced in the marketplace of the past year.

10 Jul 2013

Air Products, SEMATECH Collaborate for Development of Sub-10nm Node III-V Devices

SEMATECH today announced that Air Products, a global industrial gas and technology leader, has joined its Front End Processes (FEP) program, and will work with SEMATECH to assess advanced materials and technologies for the development of sub-10 nm node III-V devices.

10 Jul 2013

Nikon to Deliver 450 mm ArF Immersion Scanner to Albany NanoTech Complex

Nikon Corporation announced a newly established partnership agreement with the Research Foundation for the State University of New York (SUNY). Through this program, Nikon will join the Global 450 mm Consortium (G450C) headquartered at the SUNY College of Nanoscale Science and Engineering (CNSE).

From College of Nanoscale Science and Engineering, University at Albany 10 Jul 2013

Special Apparatus at Bielefeld University Accurately Determines 3D Structure of Gaseous Molecules

Using a special electron beam apparatus, scientists at Bielefeld University can determine the precise three-dimensional structure of gaseous molecules. To do this, Professor Dr Norbert Mitzel’s research team analyses the molecules in their gaseous state. Bielefeld University is the only institution in the European Union suitably equipped to conduct such gas-phase analyses. External research facilities are now able to use the device to have their substances analysed.

10 Jul 2013

Challenges in Scaling Below 14nm to be Highlighted at Semicon West 2013

Semicon West 2013 will be held July 9-11 at the Moscone Center in San Francisco, and will feature over 500 exhibitors, 50 hours of conference programs and more than 30,000 industry attendees. In advance of the 2013 SEMICON West TechXPOTs on lithography and nonplanar transistors beyond 20nm, SEMI asked some of the speakers and industry experts to comment on the challenges they wanted to highlight. Many of the inputs focused on the need for precision in the processes used to form transistors, as well as how EDA can contribute to mitigating variability.

10 Jul 2013

Solutions to Integrate Logic and Memory to Flexible or Printed Electronics

Developers have made major progress in the technology to manufacture printed or flexible circuits, sensors, batteries and displays. But frankly it’s been hard to build applications with much market pull without logic or memory as well, and those have been much harder to make.

10 Jul 2013

CEA-Leti Programs Extend 193nm Immersion Lithography for 1X Nodes

CEA-Leti said today that its multi-partner programs, IDEAL and IMAGINE, have demonstrated cost-effective solutions that extend 193nm immersion lithography for 1X nodes for critical levels such as contact and via, and for the cut layer, when multi-patterning is used.

From CEA-Leti 10 Jul 2013

3D Nanostructured Chip Watermark Ink Receives 2013 R&D 100 Award

A device that can instantly identify unknown liquids based on their surface tension has been selected to receive the 2013 R&D 100 Award—known as “the Oscar of Innovation”—from R&D Magazine.

9 Jul 2013