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Applied SEMVision G6 Defect Analysis System Improves Yield for Chip Manufacture at 1X nm

Applied Materials, Inc. today announced a suite of new defect review and classification technologies for its market-leading SEMVision(TM) family of products to accelerate time to yield for leading-edge chip manufacturing at 1X-nm and beyond.

9 Jul 2013

FormFactor to Co-Sponsor Test Vision 2020 at Semicon West for Discussing IC Wafer Test Trends

At SEMICON West this week FormFactor Inc. will stage a strong presence through executive participation in key forums and sponsorship of select industry initiatives.

9 Jul 2013

FormFactor to Co-Sponsor Test Vision 2020 at Semicon West for Discussing IC Wafer Test Trends

At SEMICON West this week FormFactor Inc. will stage a strong presence through executive participation in key forums and sponsorship of select industry initiatives.

9 Jul 2013

EV Group Unveils Fusion Wafer Bonding Platform for Manufacturing 3D-Integrated CMOS Image Sensors

EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today introduced the latest version of its EVG®40NT automated measurement system, which is designed to work in concert with the company's GEMINI® FB fusion wafer bonding system to support the manufacture of next-generation 3D-integrated CMOS image sensors.

9 Jul 2013

Jordan Valley Obtained Repeat Order for ThinFilm Metrology System from Asian Foundry

Jordan Valley, a leading supplier of X-ray based in-line metrology systems for advanced semiconductor manufacturers, today announced that it received repeat order for its new JVX7300HR front-end-of-line strain & thin films metrology system from a leading foundry in Asia.

9 Jul 2013

Michigan Technological University Researchers Build Nano Battery with AC-STEM Microscope Using Tin Oxide

Lithium ion batteries are at the energetic heart of almost all things tech, from cell phones to tablets to electric vehicles. That’s because they are a proven technology, light, long-lasting and powerful. But they aren’t perfect.

9 Jul 2013

Rice University Researchers Create New Kind of Carbon Fibers Using Graphene Oxide

Large flakes of graphene oxide are the essential ingredient in a new recipe for robust carbon fiber created at Rice University.

9 Jul 2013

Solid State Equipment Unveils WaferStorm and WaferEtch Platforms at SEMICON West 2013

Today at SEMICON West, Solid State Equipment LLC (DBA SSEC), a leading provider of single wafer wet processing systems used in the manufacture of semiconductor devices, high-brightness LEDs, and hard disc drives, announced the introduction of its WaferEtch and WaferStorm product lines.

9 Jul 2013

KLA-Tencor Announces 2910 Series Optical Wafer Defect Inspection Platform with NanoPoint Technology

Today KLA-Tencor Corporation announced the new 2910 Series optical wafer defect inspection platform with NanoPoint™ technology and the new eDR™-7100 electron-beam wafer defect review system.

9 Jul 2013

Researchers Fabricate Flexible Sensor Using Gold Nanoparticles for e-Skin Applications

Using tiny gold particles and a kind of resin, a team of scientists at the Technion-Israel Institute of Technology has discovered how to make a new kind of flexible sensor that one day could be integrated into electronic skin, or e-skin.

9 Jul 2013

Dow Corning and imec Collaborate for Advance Integration of 3D IC Semiconductor Packaging

Dow Corning, a global leader in silicones, silicon-based technology and innovation, announced today at SEMICON West 2013 that it is among the newest member organizations to join imec, a leading research center for the advancement of nano-electronics.

9 Jul 2013

Applied Materials Introduces NMOS Transistor Application for Applied Centura RP Epi System

Applied Materials, Inc. is extending its decade-long leadership in epitaxial (epi) technology with a newly developed NMOS transistor application for its Applied Centura® RP Epi system.

9 Jul 2013

Dow Corning Joins imec Nanoelectronics Research Center to Work on 3D Semiconductor PAckaging Technology

Dow Corning, a global leader in silicones, silicon-based technology and innovation, announced today that it is among the newest member organizations to join imec, a leading research center for the advancement of nano-electronics. The announcement signals expanded opportunities for both organizations to combine their expertise toward the development and broader adoption of 3D integrated circuit (IC) packaging technologies, wherein IC chips are stacked in vertical 3D architectures.

From IMEC 8 Jul 2013

USHIO to Deliver Interposer Stepper for 2.5D/3D Packaging Applications to Leading Manufacturer

USHIO INC. today announced that the company has booked the large-field stepper “UX7-3Di LIS 350” for manufacturing interposers used for 2.5D/3D packaging applications, and will deliver the first unit to a leading advanced-packaging manufacturer by the end of this month.

8 Jul 2013

New Report Provides Comprehensive Quantitative Data and Forecasts for Global Graphene Market

Research and Markets has announced the addition of the "The Global Market for Graphene to 2020" report to their offering.

6 Jul 2013

Nanotechnology News

Applied SEMVision G6 Defect Analysis System Improves Yield for Chip Manufacture at 1X nm

FormFactor to Co-Sponsor Test Vision 2020 at Semicon West for Discussing IC Wafer Test Trends

FormFactor to Co-Sponsor Test Vision 2020 at Semicon West for Discussing IC Wafer Test Trends

EV Group Unveils Fusion Wafer Bonding Platform for Manufacturing 3D-Integrated CMOS Image Sensors

Jordan Valley Obtained Repeat Order for ThinFilm Metrology System from Asian Foundry

Michigan Technological University Researchers Build Nano Battery with AC-STEM Microscope Using Tin Oxide

Rice University Researchers Create New Kind of Carbon Fibers Using Graphene Oxide

Solid State Equipment Unveils WaferStorm and WaferEtch Platforms at SEMICON West 2013

KLA-Tencor Announces 2910 Series Optical Wafer Defect Inspection Platform with NanoPoint Technology

Researchers Fabricate Flexible Sensor Using Gold Nanoparticles for e-Skin Applications

Dow Corning and imec Collaborate for Advance Integration of 3D IC Semiconductor Packaging

Applied Materials Introduces NMOS Transistor Application for Applied Centura RP Epi System

Dow Corning Joins imec Nanoelectronics Research Center to Work on 3D Semiconductor PAckaging Technology

USHIO to Deliver Interposer Stepper for 2.5D/3D Packaging Applications to Leading Manufacturer

New Report Provides Comprehensive Quantitative Data and Forecasts for Global Graphene Market

News Categories

New Research Reveals Nanoplastics’ Damaging Effect on Brain Cells

Covalent Organic Nanosheets Boost Sodium-Ion Battery Life

Single-Step Synthesis of Carbon Nanotubes for Better Energy Storage

Maximizing Vinegar's Power to Combat Antibiotic Resistance

Nanoparticles That Boost Tomato Plant Growth

Enhancing Slurry Stability in Lithium-Ion Batteries with Turbiscan Technology

PiFM and its Role in Nanoscale Chemical Imaging

Conversations on AFM: How AI is Automating Scanning Probe Microscopy

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