Posted in | Nanomaterials

How to Cleave a Wafer into Die Sized Pieces

whole wafer cleaving with LG tools

Starting with a whole wafer, this instructional video shows you how to downsize a wafer into die sized pieces. The process results in high quality, clean samples that can be used for further analysis. The LatticeGear Cleaving Kit (WCSK-102LG) is required to perform this process and the LatticeScriber (LGUS-100) is also useful, having a long life diamond scribe tip designed specifically for semiconductor materials.

Other Videos by this Supplier


  1. Yilliang Peng Yilliang Peng United States says:

    I appreciate the video on how to cut a silicon wafer into little-sized pieces! My wife was trying to do it with scissors for the longest time; however, after watching this video, I think she will invest in some more proper tools. I never knew that Could you cut the wafer into other shapes? Thanks for the great information!

The opinions expressed here are the views of the writer and do not necessarily reflect the views and opinions of

Tell Us What You Think

Do you have a review, update or anything you would like to add to this video content?

Leave your feedback
Your comment type

Nanotechnology Videos by Subject Matter

While we only use edited and approved content for Azthena answers, it may on occasions provide incorrect responses. Please confirm any data provided with the related suppliers or authors. We do not provide medical advice, if you search for medical information you must always consult a medical professional before acting on any information provided.

Your questions, but not your email details will be shared with OpenAI and retained for 30 days in accordance with their privacy principles.

Please do not ask questions that use sensitive or confidential information.

Read the full Terms & Conditions.