How to Cleave a Wafer into Die Sized Pieces
whole wafer cleaving with LG tools
Starting with a whole wafer, this instructional video shows you how to downsize a wafer into die sized pieces. The process results in high quality, clean samples that can be used for further analysis. The LatticeGear Cleaving Kit (WCSK-102LG) is required to perform this process and the LatticeScriber (LGUS-100) is also useful, having a long life diamond scribe tip designed specifically for semiconductor materials.