Posted in | Nanomaterials

How to Cleave a Wafer into Die Sized Pieces

Starting with a whole wafer, this instructional video shows you how to downsize a wafer into die sized pieces. The process results in high quality, clean samples that can be used for further analysis. The LatticeGear Cleaving Kit (WCSK-102LG) is required to perform this process and the LatticeScriber (LGUS-100) is also useful, having a long life diamond scribe tip designed specifically for semiconductor materials.

Other Videos by this Supplier

Comments

  1. Yilliang Peng Yilliang Peng United States says:

    I appreciate the video on how to cut a silicon wafer into little-sized pieces! My wife was trying to do it with scissors for the longest time; however, after watching this video, I think she will invest in some more proper tools. I never knew that Could you cut the wafer into other shapes? Thanks for the great information!

The opinions expressed here are the views of the writer and do not necessarily reflect the views and opinions of AZoNano.com.

Tell Us What You Think

Do you have a review, update or anything you would like to add to this video content?

Leave your feedback
Submit

Nanotechnology Videos by Subject Matter