Posted in | Nanomaterials

Downsizing a Silicon (111) wafer with the FlipScribe

Downsizing a Silicon (111) wafer with the FlipScribe

The 4" wafer is downsized into quarters using the FlipScribe. It is first cleaved along a crystal plane in half and then into quarters by scribing across the entire half wafer. The scribe overcomes the (111) crystal line to produce the 1/4 wafer piece.

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