Posted in | Nanotechnology Applications

Bio-Sensor That Uses Semiconductor Diode Structure

Request Quote

Dr. Sawamura of the National Institute for Materials Science (NIMS) presented a bio-sensor that uses a semiconductor diode structure at the nano tech 2009 show. This bio-sensor uses a metal-insulator-semiconductor diode formed on a silicon substrate, and NIMS is targeting applications of the bio-sensor for research and detection of infectious diseases and such. NIMS is already advancing with the development of technology to mass produce the bio-sensor and is targeting practical applications within two and a half to three years.

Run time: 1.56 mins

Request Quote

Tell Us What You Think

Do you have a review, update or anything you would like to add to this video content?

Leave your feedback

Public Comment

Private Feedback to AZoNano.com

Submit

Nanotechnology Videos by Subject Matter

How Piezo Controller Design Influences Thermal Stability

Brian O'Connor

In this interview Brian O'Connor speaks to AZoNano about how piezo controller design influences thermal stability.

How Piezo Controller Design Influences Thermal Stability

Novel Nanomaterials for Improved Food Safety

Prof. Antje J. Baeumner

Novel Nanomaterials for improved food safety.

Novel Nanomaterials for Improved Food Safety

Generating New Size-Specific Nanoparticles Within a Day

Vincent Laban

VSPARTICLE have developed a new instrument that uses spark ablation to produce particular nanoparticles, of a set size distribution, all in one afternoon.

Generating New Size-Specific Nanoparticles Within a Day

Helios G4 PFIB DualBeam™ for Materials Science

Helios G4 PFIB DualBeam™ for Materials Science

The Helios G4 PFIB enables breakthroughs in innovation with DualBeam™ technology. It delivers unrivalled capabilities for large volume 3D characterization and is able to handle Ga+ free sample preparation and precise micromachining quickly and easily.

From Thermo Scientific – Electron Microscopy Solutions

QPAC® 60 - Poly (Butylene Carbonate)

QPAC® 60 is made up of no less than 94% Poly(butylene carbonate) polymer and has less than 5% butylene carbonate and less than 1% (between 0.2%-0.8%) methylene chloride.

From Empower Materials

Hole Transport Material for Printed Electronics - P-10

Hole Transport Material for Printed Electronics - P-10

The hole transport material for printed electronics can be coated on top of the active material or the electrode by doctor blading, slot-die coating, or spin coating.

From Avantama AG