Increasing Wafer Yield with Semiconductor Wafer Stealth Dicing Methods by Intelligent Motion / Laser Control Algorithms and Motion Stages

Increasing the yield of wafers is one way to attack the current global chip shortage. One possibility to reduce losses is a laser processing method called wafer stealth dicing. Here, laser power is dosed precisely to allow a separation without damage. Along with the laser power, the position has to be controlled precisely. 

Wafer stages based on air bearing slides provide extreme accuracy and work in concert with the latest EtherCat® compatible motion controllers and laser control modules available from PI

Run time: 3:30min

Wafer Stealth Dicing / Motion Control for Laser Based Semiconductor Wafer Dicing

Video Credit: PI (Physik Instrumente) LP

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