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Posted in | Sputtering Systems

DCA仪器L400超高真空磁控溅射系统

L400超高真空磁控溅射系统是专为动产磁控管溅射顺序。传统的顺序与旋转的行星基板阶段溅射系统提供有限的基板操纵设施。在L400的设计基板阶段是静止的,序列的沉积多层移动的磁控管。这允许使用基板与移动式百叶窗屏蔽,RF和DC衬底偏压,楔形沉积和方位角基板旋转 - 的功能没有在任何其他溅射系统。

L400沉积室,有一个快速访问的磁控管差异泵浦主要法兰。磁控运动和索引是完全电脑控制,允许配方基于多层薄膜的沉积。

该系统可用于对金属,绝缘体和磁性材料使用RF或直流溅射的溅射。最大目标大小,直径4“。

Last Update: 4. October 2011 21:44

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