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Plasmatherm Reactive Ion Etch 790 RIE

Title: Plasmatherm Reactive Ion Etch 790 RIE
Company: Capovani Brothers Inc.
Location: Scotia, NY, USA
Email: cbi@capovani.com
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Description:

CINCINNATI SUB-ZERO THERMAL SHOCK 

CHAMBER -75°C TO 371° C

Manufacturer

Plasmatherm

Model

790 11 RIE

Wafer Size Range

    Minimum

50 mm

    Maximum

200 mm

Process

Reactive Ion Etch System

Controller Type

PC Controller Type

High Vacuum Pump

Leybold 361C

Roughing Pump

Leybold D40BCS

RF Generator Model

RFPP 5S, 500W

Automatch Text

RFPP AM-5

Number of Gas Inputs

Five Gas

Chillers

    Number of Chillers

1

    Chiller #1Manufacturer/Model

Neslab HX 75, Air cooled

Power Requirements

208 V     60 Hz     3 Phase

Year of Manufacture

1998

Close Date: March 30, 2015
Phone: Capovani Brothers Inc. / +1 (518) 346-8347
Email: cbi@capovani.com
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