| Title: |
EV Group Wafer to Wafer Bond Aligner Smartview |
| Company: |
Capovani Brothers Inc. |
| Location: |
Scotia, NY, USA |
| Email: |
cbi@capovani.com |
|
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|
| Description: |
|
The EV Group (EVG) Smartview® Bond aligner and EV Group (EVG) 540 Wafer Bonder are used in the production of MEMs and in the emerging fields of
3D IC Packaging and Through-Silicon Via (TSV) interconnects.
A 3D integrated circuit (3D IC) is a single integrated circuit built by stacking silicon wafers and/or dies and interconnecting them vertically. This is
achieved by persisly aligning devices on two silicon wafers and subsequently bonding them together. The result is they behave as a single device. By using
TSV technology, 3D ICs can pack a great deal of functionality into a small “footprint.” This technology is not olny used in the production of MEMS, but also
in the fabrication of CMOS image sensors, and memory devices.
| Unit Price |
Unstated |
| Number of Units |
1 |
| Manufacturer |
EVG |
| Model |
Smartview Bond Aligner |
| Description |
300mm Wafer to Wafer Bond Aligner |
| Wafer Size Range |
|
| Minimum |
150 mm |
| Maximum |
300 mm |
| Set Size |
300 mm |
| Other Information |
- High resolution alignment stage with DC servomotors in X, Y and Theta
- Alignment accuracy +/- 1 um (one sigma) with 20x objectives
- Top and bottom stage with precision measurement system
- Complete computer control of all mechanical movements in the aligner.
- 17" flat screen for operator interface and alignment functions
- Joystick control of all alignment movements and microscope movement in Z.
- Unique three spindle alignment stage for shift free Z movements
- Remote Diagnostics via modem
|
| Year of Manufacture |
2005 |
| CE Marked |
YES |
| Exterior Dimensions |
| Width |
52.000 in (132.1 cm) |
| Depth |
47.000 in (119.4 cm) |
| Height |
80.000 in (203.2 cm) |
| Weight |
1,534 lb (696 kg) |
|
| Close Date: |
January 26, 2018 |
| Phone: |
1(518) 346 8347 |
| Email: |
cbi@capovani.com |